Manufacturing method of embedded packaging structure with air resonant cavity
A technology of packaging structure and manufacturing method, which is applied in the fields of printed circuit manufacturing, chemical instruments and methods, electrical components, etc., can solve the problems of low output, high precision required for operating equipment, and low yield.
Active Publication Date: 2020-11-03
NANTONG ACCESS SEMICON CO LTD
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Problems solved by technology
This method is difficult to process, and the air cavity needs to go through subsequent processes, which is prone to air leakage, and the depth of the air cavity is difficult to adjust, resulting in a low yield
[0009] Therefore, in the prior art, the method of forming an air cavity in the packaging structure has problems such as high precision of operating equipment, harsh stability, inflexible design, low output per unit time, high cost, and low yield.
Method used
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Embodiment Construction
[0051] In the following description, reference is made to a support structure consisting of metal vias in a dielectric matrix, in particular copper via posts in a polymer matrix such as glass fiber reinforced polyimide , epoxy resin or BT (bismaleimide / triazine resin), polyphenylene ether (PPE or PPO) or their blends.
[0052] Figures 5(a) to 5(q)A schematic cross-sectional view showing the intermediate structure obtained by the method of the present invention. A manufacturing method of an embedded package structure with an air resonant cavity includes the following steps: manufacturing a frame 101 with a first copper pillar 1011 and a chip socket 1012—step (a), as shown in FIG. 5( a ). This step can include the following sub-steps:
[0053] Prepare a sacrificial carrier, usually the sacrificial carrier is a copper carrier;
[0054] Arranging a photoresist layer on the sacrificial carrier;
[0055] patterning the photoresist layer;
[0056] Electroplating copper in the p...
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Abstract
The invention provides a manufacturing method of an embedded packaging structure with an air resonant cavity, and the method comprises the following steps: (a) manufacturing a first substrate which comprises a first insulating layer, a chip embedded in the insulating layer, and a wiring layer on a chip terminal surface of the first substrate, wherein the wiring layer is provided with an opening for exposing a chip terminal surface; (b) manufacturing a second substrate, wherein the second substrate comprises a second insulating layer; (c) locally applying a first adhesive layer on the wiring layer so that the opening exposing the chip terminal surface is not covered, and applying a second adhesive layer on the second substrate; (d) laminating and curing the first bonding layer of the firstsubstrate and the second bonding layer of the second substrate to obtain the embedded packaging structure with the air resonant cavity formed on the terminal surface of the chip.
Description
technical field [0001] The present invention relates to a method of fabricating an embedded package structure with an air resonant cavity. Background technique [0002] Filtering is a basic and important technology in signal processing. Filtering is to use filtering technology to provide desired signals from various signals, and at the same time filter out unwanted interference signals. The filter is an important device in the signal frequency domain analysis. After processing by the filter, the required signal is further enhanced (amplified), the unwanted signal is filtered out, the required signal is amplified and the unwanted signal is filtered out. The principle is realized by using the resonance (resonance) of the signal in the medium. [0003] Taking the surface acoustic wave filter as an example, there are two transducers on the substrate of the piezoelectric material, the transmitting end and the receiving end. The input signal is applied to the transmitting end tra...
Claims
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IPC IPC(8): H03H3/08
CPCH03H3/08H01P11/008C25D3/38C25D7/12C25D5/022H05K3/4697H05K3/18H05K3/12H05K3/32H01L23/315H01L23/528B32B37/1284C25D7/00
Inventor 陈先明冯磊黄本霞冯进东洪业杰
Owner NANTONG ACCESS SEMICON CO LTD