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Wafer grinding oil and preparation method thereof

A technology for grinding oil and wafers, which is applied in the petroleum industry, water-based dispersants, additives, etc. It can solve the problems of rust mixed into the grinding liquid, insufficient anti-rust ability, and corrosion of the grinding disc, so as to reduce the scratch rate and reduce the loss. , Increase the effect of lubricity

Inactive Publication Date: 2020-11-17
威科赛乐微电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, the existing grinding oil has insufficient anti-rust ability, which will cause the grinding disc to rust during use, and the formed rust will be mixed into the grinding liquid, resulting in damage to the wafer

Method used

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  • Wafer grinding oil and preparation method thereof
  • Wafer grinding oil and preparation method thereof

Examples

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Effect test

Embodiment 1

[0032] The grinding oil in this embodiment includes 8% sodium azelaic acid amide, 8% sodium laurate, 10% monoethanolamine, 25% triethanolamine, and 49% water.

[0033] According to the proportion, each raw material was weighed respectively, firstly, sodium azelaic acid amide was added into water, and continued to stir until it was completely dissolved, then sodium laurate was added, stirred to dissolve, then monoethanolamine and triethanolamine were added and stirred evenly to obtain grinding oil.

Embodiment 2

[0035] The grinding oil in this embodiment includes 10% sodium azelaic acid amide, 10% sodium laurate, 10% monoethanolamine, 25% triethanolamine, and 45% water.

[0036] According to the proportion, each raw material was weighed respectively, firstly, sodium azelaic acid amide was added into water, and continued to stir until it was completely dissolved, then sodium laurate was added, stirred to dissolve, then monoethanolamine and triethanolamine were added and stirred evenly to obtain grinding oil.

Embodiment 3

[0038] The grinding oil in this embodiment includes 8% sodium azelaic acid amide, 8% sodium laurate, 10% monoethanolamine, 15% triethanolamine, and 59% water.

[0039] According to the proportion, each raw material was weighed respectively, firstly, sodium azelaic acid amide was added into water, and continued to stir until it was completely dissolved, then sodium laurate was added, stirred to dissolve, then monoethanolamine and triethanolamine were added and stirred evenly to obtain grinding oil.

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Abstract

The invention discloses wafer grinding oil and a preparation method thereof, and relates to the technical field of semiconductor materials. The invention relates to wafer grinding oil, which is prepared from the following raw materials in percentage by mass: 8 to 10 percent of sodium azelate amide, 8 to 10 percent of sodium laurate, 10 to 20 percent of monoethanolamine, 15 to 25 percent of triethanolamine and 35 to 59 percent of water. The grinding oil particularly includes, by mass: 8% of the sodium azelate amide, 8% of the sodium laurate, 10% of the monoethanolamine, 25% of the triethanolamine and 49% of the water. The preparation method of the grinding oil comprises the following steps: weighing the raw materials in proportion, adding the sodium azelate amide into the water, continuously stirring until the sodium azelate amide is completely dissolved, adding the sodium laurate, stirring and dissolving the components, and adding monoethanolamine and triethanolamine, and uniformly stirring all the components to obtain the grinding oil. The invention discloses wafer grinding oil and a preparation method thereof; the wafer grinding oil has good antirust capability, can effectively prevent a grinding disc from rusting, and further guarantees the grinding quality of indium phosphide wafers.

Description

technical field [0001] The invention relates to the technical field of semiconductor materials, in particular to a wafer polishing oil and a preparation method thereof. Background technique [0002] In the whole semiconductor material processing, the grinding process is a very important process. The main function of grinding is to use the abrasive particles coated or pressed on the grinding tool to finish the machined surface (such as cutting) through the relative movement of the grinding tool and the workpiece under a certain pressure. Grinding can be used to process various metal and non-metal materials. The processed surface shapes include plane, inner and outer cylindrical and conical surfaces, convex and concave spherical surfaces, threads, tooth surfaces and other profiles. [0003] Wafer grinding is one of the most important processes before wafer polishing, and it is also an important link to remove slight defects of the wafer, adjust the flatness of the wafer surfa...

Claims

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Application Information

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IPC IPC(8): C09G1/04C10M141/06C10N30/12C10N30/06
CPCC09G1/04C10M141/06C10M2207/127C10M2215/042C10M2215/12
Inventor 周一毕洪伟刘留苏小平
Owner 威科赛乐微电子股份有限公司