Resin composition, and prepreg, insulating film, metal foil-clad laminate and printed circuit board having same

A technology of resin composition and prepreg, which is applied in the direction of metal layered products, synthetic resin layered products, printed circuits, etc., can solve the problems affecting the water absorption rate of the final cured product, achieve excellent heat resistance, increase crosslinking density, The effect of excellent dielectric properties

Active Publication Date: 2020-11-20
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, these compounds all contain hydroxyl groups, which will affect the water absorption and other properties of the final cured product.

Method used

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  • Resin composition, and prepreg, insulating film, metal foil-clad laminate and printed circuit board having same
  • Resin composition, and prepreg, insulating film, metal foil-clad laminate and printed circuit board having same
  • Resin composition, and prepreg, insulating film, metal foil-clad laminate and printed circuit board having same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0093] Synthesis Example 1: Synthesis of Dicyclopentadienyl Active Ester Compound

[0094] Get 1mol of dicyclopentadienyl phenol resin and 2mol of p-aminobenzoic acid (PABA), stir and dissolve in toluene solvent evenly, under the temperature condition of 60 ℃, feed nitrogen simultaneously, add tetrabutylammonium bromide catalyst, Then slowly drip a 20% sodium hydroxide aqueous solution, react for 4 hours, then finish the reaction and wash several times, and dry for 5 hours under vacuum conditions at 105°C to obtain the dicyclopentadienyl active ester Compound, denoted as active ester A.

Synthetic example 2

[0095] Synthesis Example 2: Synthesis of Tricyclopentadienyl Active Ester Compound

[0096] Take 1mol tricyclopentadienylphenol resin and 2mol p-aminobenzoic acid (PABA), stir and dissolve in toluene solvent evenly, and at a temperature of 60°C, feed nitrogen at the same time, add tetrabutylammonium bromide catalyst, Then slowly drip a 20% sodium hydroxide aqueous solution, react for 4 hours, and after the reaction is completed, after several washings, dry for 5 hours under vacuum conditions at 105°C to obtain the tricyclopentadienyl activity The ester compound is denoted as active ester B.

Synthetic example 3

[0097] Synthesis example 3: Synthesis of naphthyl active ester compound

[0098] Take 1 mol of naphthol resin and 2 mol of p-aminobenzoic acid (PABA), stir and dissolve in toluene solvent evenly, and at a temperature of 60°C, feed nitrogen at the same time, add tetrabutylammonium bromide catalyst, and then slowly drop into Concentration is 20% sodium hydroxide aqueous solution, react for 4 hours, then after several times of washing after reaction, under vacuum condition of 105 ℃, dry 5h, obtain described naphthyl active ester compound, denote as active ester C.

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Abstract

The invention provides a resin composition, which has high glass transition temperature, high peel strength, low coarsening degree, low dielectric loss, high heat resistance, low water absorption andgood dielectric property compared with the existing resin composition. The invention also provides a prepreg, an insulating film, a metal foil-clad laminated board and a printed circuit board which are prepared by using the resin composition.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a resin composition with high adhesion, low roughness, high heat resistance, low water absorption and good dielectric properties and a prepreg, insulating film, Metal clad laminates, and printed circuit boards. Background technique [0002] In recent years, the focus of the printed circuit board market has shifted from computers to communications, especially mobile terminals such as smartphones and tablet computers. Therefore, HDI boards for mobile terminals are the main point of PCB growth. Mobile terminals represented by smartphones drive HDI boards to be denser and thinner. According to literature reports, in the future, the line width / spacing L / S (Line and Space) of PCB boards will be required to reach 10 / 10 μm or less. Therefore, the Ra value (average roughness) of the laminated insulating layer needs to reach 300nm Or less, the cohesiveness reaches above 0.6kgf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/50C08K3/36C08K7/14C08J5/24B32B17/02B32B15/20B32B17/06B32B27/04B32B27/38H05K1/03
CPCC08L63/00C08G59/504C08J5/24B32B5/02B32B15/20B32B15/14B32B5/26H05K1/0366H05K1/0373C08J2363/00C08K3/36C08K7/14B32B2260/021B32B2260/023B32B2260/046B32B2262/101B32B2307/306B32B2307/726B32B2457/08
Inventor 崔春梅杨宋黄荣辉陈诚肖升高
Owner SHENGYI TECH SUZHOU
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