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A kind of low-temperature fast-drying polymer-based conductive adhesive and preparation method thereof

A polymer, conductive adhesive technology, applied in conductive adhesives, adhesives, adhesive types, etc., can solve the problems of poor conductivity and poor system stability of conductive adhesives, achieve stable conductive network, promote curing, and facilitate storage. Effect

Active Publication Date: 2022-03-15
ZHUZHOU FEILU ADVANCED MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art, and provide a low-temperature quick-drying polymer-based conductive adhesive and its preparation method to solve the problem of poor conductivity and poor system stability of the conductive adhesive in the prior art. Disadvantages such as rapid curing at low temperature in the environment

Method used

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  • A kind of low-temperature fast-drying polymer-based conductive adhesive and preparation method thereof
  • A kind of low-temperature fast-drying polymer-based conductive adhesive and preparation method thereof
  • A kind of low-temperature fast-drying polymer-based conductive adhesive and preparation method thereof

Examples

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Effect test

Embodiment 1

[0051] A low-temperature quick-drying polymer-based conductive adhesive of the present invention, comprising A component and B component, in parts by weight, A component includes: 13 parts of bisphenol A type epoxy resin, 80 parts of conductive filler; 4 parts of carboxyl liquid nitrile rubber, 1 part of triethylhexyl phosphoric acid, 2 parts of D6802; component B includes: 70 parts of polyamide curing agent, 10 parts of DDS, 20.5 parts of xylene, 0.5 part of n-butanol; among them, conductive filler It is a mixture of acidified and reduced micron copper powder and nanometer copper graphene. The preparation process is as follows:

[0052] 1) Add 100g of micron copper powder into 5% dilute sulfuric acid solution, ultrasonically treat for 40 minutes to remove oxides on the surface of the copper powder, rinse with deionized water after suction filtration, remove residual dilute sulfuric acid, and then transfer the copper powder to an anhydrous Sonicate in ethanol for 20 minutes an...

Embodiment 2

[0080] The formula and preparation method are the same as in Example 1. When preparing the sample, take the upper layer paste and the lower layer paste of component A and mix them with component B.

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Abstract

The invention discloses a low-temperature quick-drying polymer-based conductive adhesive, which comprises component A and component B with a mass ratio of 10-15:1. In parts by weight, component A includes a polymer matrix resin, a conductive filler ( A mixture of copper powder and graphene loaded with nano-copper), a wetting and dispersing agent, a thixotropic agent, and component B is a curing agent. Its preparation method: S1: remove water from the polymer matrix resin, then add wetting and dispersing agent, thixotropic agent and toughening agent to the polymer matrix resin, stir and disperse evenly; S2: add conductive The filler is uniformly dispersed to obtain component A, which is placed at room temperature and sealed for later use; S3: the solvent, curing agent and curing accelerator are mixed evenly to obtain component B, which is placed at room temperature and sealed for later use. The polymer-based conductive adhesive of the present invention introduces a mixture of copper powder and graphene slurry loaded with nano-copper as a conductive filler, which greatly improves the conductive performance of the conductive adhesive and makes it have a more stable conductive path.

Description

technical field [0001] The invention relates to a polymer-based conductive adhesive, in particular to a low-temperature quick-drying polymer-based conductive adhesive and a preparation method thereof. Background technique [0002] Conductive adhesive is a special adhesive that has both adhesion and conductivity after curing. It is mainly made by adding conductive fillers and other additives to the organic polymer matrix. After curing, the conductive particles are combined through the bonding effect of the matrix resin. A conductive path is formed, resulting in an adhesive with high electrical conductivity. Conductive adhesives are widely used in electronic packaging, integrated circuits and other fields. [0003] However, polymer-based conductive adhesives also have some problems in practical applications, such as poor conductivity in various environments, long curing time, high curing temperature, and poor storage stability. For example, the patent application document wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J9/02C09J11/08
CPCC09J163/00C09J9/02C09J11/08C08K2201/011C08K2201/001C08K2003/085C08K2201/014C08L13/00C08K13/06C08K9/02C08K3/08C08K9/12
Inventor 刘佳娜杨文元周虎黄立志郭海涛童鑫毛先安陆雄范国栋苏乙清
Owner ZHUZHOU FEILU ADVANCED MATERIAL TECH CO LTD
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