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Chip solid tantalum capacitor and coating process thereof

PendingCN122091401Ahigh densityStrong bonding between layersElectrolytic capacitorsDrying/impregnating machinesCapacitanceTantalum capacitor
The invention relates to a chip solid capacitor and a coating process thereof, the chip solid tantalum capacitor is composed of a tantalum block, a dielectric oxide layer, a cathode layer, a transition layer, a silver layer and a plastic package layer, the cathode layer is a manganese dioxide layer, and the manganese dioxide layer is formed by thermal decomposition on the tantalum block on which the dielectric oxide layer grows through the coating process; the specific operation of the coating process is specifically limited, and the tantalum block is sequentially impregnated with thin-thick-thick-thin coating liquid, so that the prepared cathode layer is high in density, high in interlayer binding force and free of bubbling and delamination defects, the qualification rate and the moisture resistance of the product are greatly improved, meanwhile, parameters of all stages are controllable and adjustable, and the production cost is reduced. And the production requirements of high-specific-volume tantalum capacitors with different specific volume grades can be met, and the method has a good industrial application prospect.
Owner:FUJIAN TORCH ELECTRON TECH CO LTD