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A kind of room temperature curing high temperature resistant epoxy resin adhesive and its preparation method and application

A technology of epoxy resin and epoxy resin matrix, which is applied in the direction of in-line phenolic epoxy resin adhesive, non-polymer adhesive additive, adhesive additive, etc. Effect

Active Publication Date: 2021-11-12
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the operating temperature of ordinary epoxy resins generally does not exceed 300°C, which has been difficult to meet the continuous development of aerospace, aviation, electronics and other modern science and technology requirements for epoxy resin materials to withstand high temperatures of 600°C, and due to the Special process requirements often require adhesives to have room temperature curing process characteristics, so as to meet the needs of use

Method used

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  • A kind of room temperature curing high temperature resistant epoxy resin adhesive and its preparation method and application
  • A kind of room temperature curing high temperature resistant epoxy resin adhesive and its preparation method and application
  • A kind of room temperature curing high temperature resistant epoxy resin adhesive and its preparation method and application

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preparation example Construction

[0068] Preparation of amino compounds containing meta-carborane in structure A: Add 1 part of meta-carborane to 2 parts of NaN under the protection of nitrogen flow 3 in toluene, stirred at 110°C and refluxed for 4h, filtered to remove excess NaN 3 And wash the filtrate with distilled water. Under the protection of nitrogen flow, the mixture was stirred and heated at 60°C for 2 hours. The reaction mixture was poured into ice water, the pH value of the mixture was adjusted to neutral with lye and extracted with ether, and anhydrous MgSO was added. 4 After removing the distilled water, the amino compound containing m-carborane with the structure shown in formula (A): diamino-m-carborane can be obtained.

[0069] The preparation of the amino compound containing m-carborane in structure B: (1) dissolve the m-carborane of 1 part of substance in the dry ethylene glycol dimethyl ether of 10 parts by volume, in an ice-water bath Under the protection of nitrogen atmosphere, add dropw...

Embodiment 1

[0072] Use novolac epoxy resin F51 as the epoxy resin matrix, add zinc oxide and sericite as heat-resistant fillers, the mass ratio of novolac epoxy resin F51 to zinc oxide and sericite is 100:10:20, and mix them evenly with a planetary mixer as A component.

[0073] Introduce the prepared diamine-based meta-carborane of the A structure into the 593 curing agent based on the adduct of diethylenetriamine and propylene oxide butyl ether, the 593 curing agent and the diamine-based meta-carborane The mass ratio of carborane is 100:60, and it is uniformly mixed by a planetary mixer as component B.

[0074] When in use, mix components A and B at a mass ratio of 100:100, and obtain a cured product of a high-temperature-resistant epoxy resin adhesive after 7 days at room temperature.

[0075] The cured product has a mass retention rate of 70% at 800°C in an air atmosphere ( figure 1 Curve b) in .

[0076] Using the cured product of the epoxy resin adhesive obtained in this example ...

Embodiment 2

[0078] Use novolac epoxy resin F44 as the epoxy resin matrix, add cerium oxide and sepiolite as heat-resistant fillers, the mass ratio of novolac epoxy resin F44 to cerium oxide and sepiolite is 100:20:10, and mix through a planetary mixer After homogenization, it will be used as A component.

[0079] Introduce the bis (m-aminophenyl) m-position carborane in the prepared B structure in the 590 curing agent based on the adduct of m-phenylenediamine and phenyl glycidyl ether, 590 curing agent and bis (m- The mass ratio of aminophenyl)-m-carborane is 100:10, and it is uniformly mixed as component B through a planetary mixer.

[0080] When in use, the mass ratio of component A and component B is mixed at a ratio of 100:50, and the cured product of the high temperature resistant epoxy resin adhesive is obtained after 3 days at room temperature.

[0081] The cured product has a mass retention rate of 65% at 800°C in an air atmosphere ( figure 1 Curve c) in .

[0082] Using the cu...

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Abstract

The invention discloses a room temperature curing and high temperature resistant epoxy resin adhesive as well as a preparation method and application thereof. The epoxy resin adhesive includes A component and B component, wherein the A component includes an epoxy resin matrix and a high temperature resistant filler; the B component includes an epoxy resin curing agent and an amine-containing carborane; an amine-containing The carborane contains two amine groups, the two amine groups are respectively the end groups of the amino-containing carborane, and the amine groups are directly connected to the carborane group, or the amine groups are respectively connected through an aromatic hydrocarbon structure, a silicon group Or a siloxy group attached to a carborane group. The epoxy resin adhesive can be cured at room temperature, and the cured product has good bonding strength and can be used at a high temperature of 600°C.

Description

technical field [0001] The invention relates to a room-temperature-cured high-temperature-resistant epoxy resin adhesive, a preparation method and application thereof, and belongs to the field of high-temperature-resistant adhesive materials. Background technique [0002] Epoxy resin has become an important resin matrix widely used in bonding sealing materials and coatings due to its good mechanical properties, especially strong adhesion to metals, low curing shrinkage, excellent chemical resistance and electrical insulation Material. However, the operating temperature of ordinary epoxy resins generally does not exceed 300°C, which has been difficult to meet the continuous development of aerospace, aviation, electronics and other modern science and technology requirements for epoxy resin materials to withstand high temperatures of 600°C, and due to the Special process requirements often require adhesives to have room temperature curing process characteristics, so as to meet...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/04C09J11/04C08G59/50
CPCC08G59/50C08G59/504C08K2003/2296C09J11/04C09J163/04C08K3/22C08K3/34
Inventor 张学忠张志杰崔美丽戴丽娜赵云峰
Owner INST OF CHEM CHINESE ACAD OF SCI