Upper and lower clamping hanger for electroplated PCB

Abstract

The invention discloses an upper and lower clamping hanger for a PCB. The upper and lower clamping hanger comprises a connector; an adjusting back plate is mounted on the connector; a first sliding block and a second sliding block are mounted on the adjusting back plate; a first through hole is formed in the first sliding block; a second through hole is formed in the second sliding block; a firstsupporting rod is movably mounted in the first through hole; the first sliding block linearly moves up and down along the first supporting rod in a reciprocating mode; the second through hole is movably provided with a second supporting rod; the second sliding block linearly moves up and down along the second supporting rod in a reciprocating mode; the adjusting back plate is provided with a plurality of upper electroplating clamps used for clamping the upper portion of a PCB; the lower ends of the first supporting rod and the second supporting rod are provided with a fixed back plate; and thefixed back plate is provided with a plurality of lower electroplating clamps used for clamping the lower portion of the PCB. The upper and lower clamping hanger is high in production efficiency, lowin cost loss rate, capable of achieving automatic continuous batch production, high in yield, long in service life and free of frequent replacement.

Description

technical field [0001] The invention relates to the field of jigs for electroplating production of PCB boards, in particular to an upper and lower clamping hanger for electroplating PCB boards. Background technique [0002] The Chinese name of PCB is printed circuit board, also known as printed circuit board, which is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation ( Such as rust), improve wear resistance, electrical conductivity, reflective properties, corrosion resistance (copper sulfate, etc.) and enhance the...

AI Technical Summary

Problems solved by technology

[0003] At present, the PCB board itself is too thin during the electroplating process, and it will wrinkle and bend, so that the small aperture on the PCB board cannot be completely penetrated by the potion, and it is easy to cause holes without copper. It is necessary to use a large-flow jet to achieve better irrigation. Porosity, to meet the small holes on the PCB board to be filled, and it is also necessary to ensure the flatness of the PCB board and the uniformity of the coating during the production process

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