A kind of preparation method of 5g communication tin base tape coating halogen-free solder preform

Abstract

The invention discloses a preparation method of a 5G communication tin-based tape-coated halogen-free solder preform, which comprises the following steps: after mixing an isocyanate-based silane coupling agent with a graphene nanosheet water dispersion, stirring and reacting to obtain an improved Graphene nanosheet treatment solution; the obtained modified graphene nanosheet treatment solution is evenly sprayed on the surface of the solder preform substrate, and dried to obtain a pretreated solder preform substrate; the flux is evenly sprayed on the Pretreat the surface of the solder preform substrate and dry it to obtain the 5G communication tin baseband coated halogen-free solder preform. The coated halogen-free solder preform prepared by the invention has higher welding uniformity and lower void rate, is suitable for processing 5G substrates, and is beneficial to improving the yield and reliability of 5G products.

Description

technical field [0001] The invention relates to the technical field of solder preforms, in particular to a method for preparing a 5G communication tin baseband-coated halogen-free solder preform. Background technique [0002] With the rapid development of communication technology, especially the gradual popularization and application of 5G technology, large-substrate high-power components have been widely used, and the packaging process has a very important impact on the performance and reliability of 5G substrates. In the packaging process of the substrate, soldering is an important process. The traditional process uses solder paste for reflow soldering. Due to the volatilization of a large amount of organic solvents in the solder paste during the soldering process, a large amount of gas is generated, and eventually voids are formed. The void rate can reach more than 40%, which seriously affects the electrical conductivity and thermal conductivity of the substrate. , It is...

AI Technical Summary

Problems solved by technology

The traditional process uses solder paste for reflow soldering. Due to the volatilization of a large amount of organic solvents in the solder paste during the soldering process, a large amount of gas is generated, and eventually voids are formed. The void rate can reach more than 40%, which seriously affects the electrical conductivity and thermal conductivity of the substrate. , it is more likely to lead to problems such as product failure and poor reliability. Its low efficiency, low yield, and high cost can no longer meet the technical requirements of 5G products.