Low-hardness easily-reworked single-component heat-conducting gel and preparation method thereof

A low-hardness, one-component technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of limited application scope, difficult to repair, large amount of residual glue, etc., to achieve high transparency, low surface tension, hydrophobicity good effect

Inactive Publication Date: 2021-01-01
SHENZHEN FRD SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the large number of thermally conductive gel products currently on the market, there are problems such as a large amount of residual glue after curing, and it is not easy to repair, and after adding thermally conductive fillers, the hardness is relatively high, which limits the scope of application.

Method used

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  • Low-hardness easily-reworked single-component heat-conducting gel and preparation method thereof
  • Low-hardness easily-reworked single-component heat-conducting gel and preparation method thereof
  • Low-hardness easily-reworked single-component heat-conducting gel and preparation method thereof

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preparation example Construction

[0023] refer to figure 1 , which shows a flow chart of the steps of an embodiment of the preparation method of a low-hardness and easy-to-rework one-component thermally conductive gel of the present invention, which may specifically include the following steps:

[0024] S1. Weigh vinyl silicone oil, MQ resin, dimethyl silicone oil, coupling agent, and heat conduction powder according to the predetermined proportion by weight, knead at room temperature for 1 hour, heat to 150 degrees, and stir the heated materials under vacuum conditions 180 minutes;

[0025] S2, after cooling to room temperature, add inhibitor and hydrogen-containing silicone oil and stir for 30 minutes;

[0026] S3, adding the platinum catalyst and stirring for 30 minutes to obtain a paste, that is, a thermally conductive gel.

[0027] In the above steps, the thermally conductive gel includes, in parts by weight: 1-10 parts of vinyl silicone oil, 0.1-2 parts of MQ resin, 1-12 parts of dimethyl silicone oil,...

Embodiment 1

[0029] Weigh 6 parts of vinyl silicone oil with a viscosity of 5000mPa.s, 0.3 parts of MQ resin with a viscosity of 100mPa.s, 6 parts of dimethyl silicone oil with a viscosity of 100mPa.s, and 0.15 parts of hexadecyltrimethoxysilane. 30 parts of alumina with a diameter of 1 μm, 50 parts of alumina with a particle size of 5 μm, and 20 parts of alumina with a particle size of 20 μm, kneading at room temperature for 1 hour, then heating the material to 150 degrees, vacuuming until the vacuum degree reaches -0.1MPa, and continuing Stir for 180 minutes. After the stirring was completed, the mixture was cooled to room temperature, 2 parts of side-chain hydrogen-containing silicone oil with a hydrogen content of 0.18%, and 0.03 part of acetylene cyclohexanol were added, and stirring was continued for 30 minutes. Finally, 2000 ppm of microcapsule-type platinum catalyst (based on the mass of platinum) was added and stirred for 30 minutes, and the obtained paste was the finished heat-co...

Embodiment 2

[0031] Weigh 5 parts of vinyl silicone oil with a viscosity of 50000mPa.s, 0.3 parts of MQ resin with a viscosity of 100mPa.s, 7 parts of dimethyl silicone oil with a viscosity of 100mPa.s, and 0.15 parts of hexadecyltrimethoxysilane. 30 parts of alumina with a diameter of 1 μm, 50 parts of alumina with a particle size of 5 μm, and 20 parts of alumina with a particle size of 20 μm, kneading at room temperature for 1 hour, then heating the material to 150 degrees, vacuuming until the vacuum degree reaches -0.1MPa, and continuing Stir for 180 minutes. After the stirring was completed, the mixture was cooled to room temperature, 2 parts of side-chain hydrogen-containing silicone oil with a hydrogen content of 0.18%, and 0.03 part of acetylene cyclohexanol were added, and stirring was continued for 30 minutes. Finally, 2000 ppm of microcapsule-type platinum catalyst (based on the mass of platinum) was added and stirred for 30 minutes, and the obtained paste was the finished heat-c...

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Abstract

The invention relates to the technical field of heat-conducting gel, in particular to low-hardness easy-to-rework single-component heat-conducting gel and a preparation method thereof. The heat-conducting gel is prepared from, by weight, 1-10 parts of vinyl silicone oil, 0.1-2 part of MQ resin, 1-12 parts of dimethyl silicone oil, 0.1-10 part of hydrogen-containing silicone oil, 1500-3000 ppm of platinum catalyst, 0.01-1.5 part of inhibitor, 0.05-0.12 part of coupling agent and 70-150 part of heat-conducting powder; dimethyl silicone oil and vinyl silicone oil are mixed, so that the heat-conducting gel is endowed with good tensile strength and stripping performance, on one hand, the fluidity of a system is improved, a dispensing process is facilitated, and on the other hand, the hardness is reduced and certain demolding performance is achieved.

Description

technical field [0001] The invention relates to the technical field of thermally conductive gels, in particular to a single-component thermally conductive gel with low hardness and easy rework and a preparation method thereof. Background technique [0002] As the development of chips and electronic components tends to be denser and miniaturized, equipment and components will release a lot of heat when they are working. If they are not conducted in time, it will easily cause local high temperature, resulting in shortened life, or even failure. Many thermal interface materials have emerged as the times require, such as thermal grease, thermal pads, thermal gels, etc. are based on such applications. [0003] In the process of component assembly or testing, some components may fail to meet performance standards due to various problems. It may be that a very small component causes the entire PCB to fail to work normally, and scrapping the entire PCB will cause great damage. Wast...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 邹磊奚家国
Owner SHENZHEN FRD SCI & TECH
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