Low-hardness easily-reworked single-component heat-conducting gel and preparation method thereof

A low-hardness, one-component technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of limited application scope, difficult to repair, large amount of residual glue, etc., to achieve high transparency, low surface tension, hydrophobicity good effect
CN112159647AInactive Publication Date: 2021-01-01SHENZHEN FRD SCI & TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN FRD SCI & TECH
Publication Date
2021-01-01
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to the technical field of heat-conducting gel, in particular to low-hardness easy-to-rework single-component heat-conducting gel and a preparation method thereof. The heat-conducting gel is prepared from, by weight, 1-10 parts of vinyl silicone oil, 0.1-2 part of MQ resin, 1-12 parts of dimethyl silicone oil, 0.1-10 part of hydrogen-containing silicone oil, 1500-3000 ppm of platinum catalyst, 0.01-1.5 part of inhibitor, 0.05-0.12 part of coupling agent and 70-150 part of heat-conducting powder; dimethyl silicone oil and vinyl silicone oil are mixed, so that the heat-conducting gel is endowed with good tensile strength and stripping performance, on one hand, the fluidity of a system is improved, a dispensing process is facilitated, and on the other hand, the hardness is reduced and certain demolding performance is achieved.
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Description

technical field

[0001] The invention relates to the technical field of thermally conductive gels, in particular to a single-component thermally conductive gel with low hardness and easy rework and a preparation method thereof. Background technique

[0002] As the development of chips and electronic components tends to be denser and miniaturized, equipment and components will release a lot of heat when they are working. If they are not conducted in time, it will easily cause local high temperature, resulting in shortened life, or even failure. Many thermal interface materials have emerged as the times require, such as thermal grease, thermal pads, thermal gels, etc. are based on such applications.

[0003] In the process of component assembly or testing, some components may fail to meet performance standards due to various problems. It may be that a very small component causes the entire PCB to fail to work normally, and scrapping the entire PCB will cause great damage. Wast...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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