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Micro-channel inlet cover plate and preparation method and use method thereof

A technology of micro-channels and inlet caps, applied in chemical instruments and methods, laboratory containers, instruments, etc., can solve the problems of hose shedding and inability to achieve smaller sizes, and achieve high connection strength and bonding performance Good, guarantee the effect of consistency

Active Publication Date: 2021-01-05
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above analysis, the present invention aims to provide a microchannel inlet cover plate and its preparation and use method to solve the problem that the size of the microchannel in the prior art cannot achieve a smaller size microchannel, and there is a problem that the hose falls off. Risk and other issues

Method used

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  • Micro-channel inlet cover plate and preparation method and use method thereof
  • Micro-channel inlet cover plate and preparation method and use method thereof
  • Micro-channel inlet cover plate and preparation method and use method thereof

Examples

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preparation example Construction

[0058] A preparation method of a microchannel inlet cover plate, such as Figure 5 shown, including the following steps:

[0059] Step 1. Photolithography: Spin-coat photoresist on the surface of the wafer, perform photolithography, and define the opening pattern and position of the top large hole 2, where the photoresist is used as an etching mask.

[0060] Step 2. Top etching: BOSCH process is used for plasma etching to etch the top large hole 2 .

[0061] After the large hole 2 on the top is etched, the wafer is immersed in an organic solvent to remove the photoresist on the top.

[0062] Step 3. Temporary Bonding: Use temporary bonding glue to temporarily bond the glass slide to the top of the wafer, then turn it upside down.

[0063] Step 4. Secondary photolithography: Spin-coat photoresist on the surface of the inverted wafer, perform photolithography, and define the opening pattern and position of the small holes 3 at the bottom; wherein the photoresist is used as an ...

Embodiment 1

[0072] A microchannel inlet cover plate includes a cover plate unit 1 and a connecting pipe 4 . The cover unit 1 is a silicon cover, and the overall thickness of the cover unit 1 is 700um. The connecting pipe 4 is a stainless steel pipe, the inner diameter of the stainless steel pipe is 300um, the outer diameter is 500um, and the height is 15mm.

[0073] The cover plate unit 1 is provided with a stepped hole, and the stepped hole is composed of a top large hole 2 and a bottom small hole 3, and the top large hole 2 and the bottom small hole 3 are arranged coaxially. The depth of the large hole 2 at the top is 500um and the diameter is 600um, and the depth of the small hole 3 at the bottom is 200um and the diameter is 200um.

[0074] The connecting pipe 4 is arranged in the large hole 2 at the top of the cover unit 1 , and the bottom of the connecting pipe 4 is in contact with and fixed on the upper surface of the small hole 3 at the bottom.

Embodiment 2

[0076] A method for preparing a microchannel inlet cover plate, comprising the following steps:

[0077] A silicon wafer with a thickness of 700 um is used to prepare a silicon cover plate, and the connecting pipe 4 is a stainless steel pipe with an inner diameter of 0.3 mm and an outer diameter of 0.5 mm.

[0078] Step 1. Spin-coat photoresist with a thickness of 10um on the surface of the silicon wafer, perform photolithography, and open holes with an aperture of 600um;

[0079] Step 2. Use the deep silicon etching BOSCH process to perform plasma etching on the top of the silicon wafer, and the etching depth is about 500um;

[0080] Step 3. Use temporary bonding glue to temporarily bond the glass slide to the top of the silicon wafer, then turn it upside down;

[0081] Step 4. Spin-coat photoresist with a thickness of 10um on the surface of the inverted silicon wafer, and perform photolithography to define the opening pattern and position of the bottom small hole 3; wherein...

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Abstract

The invention discloses a micro-channel inlet cover plate and a preparation method and use thereof, belongs to the technical field of micro-nano processing, and solves the problems that in the prior art, a micro-channel with a smaller size cannot be realized, and the risk that a hose falls off exists. The micro-channel inlet cover plate comprises a cover plate unit and a connecting pipe, stepped holes are formed in the cover plate units, each stepped hole is composed of a large top hole and a small bottom hole, the large top holes and the small bottom holes are coaxially formed, the outer diameter of the connecting pipe is smaller than the inner diameter of the top large hole and larger than the inner diameter of the bottom small hole, the connecting pipe is arranged in the top large holeof the cover plate unit, and the bottom of the connecting pipe makes contact with and is fixed to the upper surface of the bottom small hole. The micro-channel inlet cover plate is suitable for conveying liquid to the micro-fluidic chip.

Description

technical field [0001] The invention belongs to the technical field of micro-nano processing, and in particular relates to a micro-channel inlet cover plate and a preparation and use method thereof. Background technique [0002] Microfluidic chip is the extension and promotion of integrated circuit chip technology in the field of biochemistry, and it is the miniaturization of biochemical analysis and experiment. Traditional biological or chemical experimental devices are a combination of beakers, flasks, and connecting tubes, as well as injection, infusion, and detection systems; microfluidic chips shrink these systems to a flat substrate of micron or millimeter size. The benefits of using microfluidic chips are: reducing the cost of manufacturing, using and handling; reducing analysis time; reducing the use of reagents and analytes; reducing the output of harmful products; enhancing portability; Difficult or even impossible questions. [0003] The existing microfluidic ch...

Claims

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Application Information

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IPC IPC(8): B01L3/00G01N33/00
CPCB01L3/5027G01N33/00B01L2200/10
Inventor 王鑫杨海博王启东
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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