Micro-channel inlet cover plate and preparation method and use method thereof
A technology of micro-channels and inlet caps, applied in chemical instruments and methods, laboratory containers, instruments, etc., can solve the problems of hose shedding and inability to achieve smaller sizes, and achieve high connection strength and bonding performance Good, guarantee the effect of consistency
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[0058]A preparation method of the micro flow channel entrance cover, such asFigure 5 As shown, including the following steps:
[0059]Step 1. Photolithography: Spin-coating photoresist on the surface of the wafer and perform photolithography to define the opening pattern and position of the top large hole 2, where the photoresist is used as an etching mask.
[0060]Step 2. Top etching: Plasma etching is performed using the BOSCH process to etch large holes 2 on the top.
[0061]After the large hole 2 on the top is etched, the wafer is immersed in an organic solvent to remove the photoresist on the top.
[0062]Step 3. Temporary bonding: Use temporary bonding glue to temporarily bond the glass slide to the top of the wafer, and then turn it upside down.
[0063]Step 4. Secondary photolithography: spin-coating photoresist on the surface of the inverted wafer, and perform photolithography to define the pattern and position of the bottom hole 3; the photoresist is used as an etching mask.
[0064]Step 5....
Example Embodiment
[0071]Example 1
[0072]A micro flow channel entrance cover plate includes a cover plate unit 1 and a connecting pipe 4. The cover plate unit 1 is a silicon cover plate, and the overall thickness of the cover plate unit 1 is 700um. The connecting pipe 4 is a stainless steel pipe with an inner diameter of 300um, an outer diameter of 500um, and a height of 15mm.
[0073]The cover plate unit 1 is provided with a stepped hole, the stepped hole is composed of a top large hole 2 and a bottom small hole 3, and the top large hole 2 and the bottom small hole 3 are arranged coaxially. The large hole 2 at the top has a depth of 500um and an aperture of 600um, and the small hole 3 at the bottom has a depth of 200um and an aperture of 200um.
[0074]The connecting pipe 4 is arranged in the large hole 2 at the top of the cover plate unit 1, and the bottom of the connecting pipe 4 is in contact with and fixed to the upper surface of the small hole 3 at the bottom.
Example Embodiment
[0075]Example 2
[0076]A preparation method of a micro flow channel entrance cover plate includes the following steps:
[0077]The silicon cover plate is prepared by using a silicon wafer with a thickness of 700um, and the connecting pipe 4 is a stainless steel pipe with an inner diameter of 0.3 mm and an outer diameter of 0.5 mm.
[0078]Step 1. Spin-coating photoresist with a thickness of 10um on the surface of the silicon wafer, and perform photolithography with an aperture of 600um;
[0079]Step 2. Use the deep silicon etching BOSCH process to perform plasma etching on the top of the silicon wafer, the etching depth is about 500um;
[0080]Step 3. Use temporary bonding glue to temporarily bond the glass slide to the top of the silicon wafer, and then turn it upside down;
[0081]Step 4. Spin-coating 10um photoresist on the surface of the inverted silicon wafer, and perform photolithography to define the pattern and position of the bottom hole 3; the photoresist is used as an etching mask; the bo...
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