High-power chip heat dissipation system and method with built-in intestinal villus imitating micro-needle ring

Abstract

The invention discloses a high-power chip heat dissipation system with a built-in intestinal villus-like micro-needle ring and a method. An air-cooling or water-cooling environment is only manufactured outside a heat absorption box, so that the heat dissipation requirement of a high-power chip is difficult to realize. An air outlet in the top of a fan is attached to a double-vortex-shaped linear condenser pipe; three layers of coiled liquid channels are fixed in the heat absorption box, and a plurality of intestinal villus imitating microneedle rings are embedded in the channels; an inlet of the three-layer coiled liquid channel is connected with an outlet of an inlet peristaltic pump through a hose, and an inlet of the inlet peristaltic pump is connected with an outlet of an outlet peristaltic pump through a hose and a double-vortex linear condenser pipe; an inlet of the outlet peristaltic pump is connected with an outlet of the three-layer disc curved liquid channel through a hose; thermocouples are fixed to the side faces of the heat absorption boxes, and hexagonal honeycomb-shaped microneedle array sets are fixed to the top faces of the heat absorption boxes. The external air cooling system and the internal liquid cooling system are combined, the heat exchange efficiency is improved through multiple structures for increasing the heat dissipation area and prolonging the heatexchange time of cooling liquid, and the heat dissipation requirement of a high-power chip is met.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and in particular relates to a high-power chip heat dissipation system and a heat dissipation method with a built-in microneedle ring imitating small intestine villi. Background technique [0002] With the advancement of science and technology and the development of the times, electronic equipment products are constantly being introduced. According to Moore's Law, when the selling price of electronic products is stable, the number of transistors installed on integrated circuits will quickly double, with a period of about 18 months, and its performance will also double. A more highly integrated circuit means a higher heat flux, which will inevitably lead to a higher operating temperature. [0003] In the field of electronic products, with the rapid development of the microelectronic equipment industry, the size of electronic chips continues to decrease and the power density continues to ...

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Problems solved by technology

[0005] The present invention aims at the problem that the current high-power chip size is continuously reduced and the power density is continuously increased, but the traditional chip heat sink cannot meet the increasing heat dissipation requirements of the chip, and provides a high-power chip heat dissipation system with a built-in microneedle ring imitating small intestine villi And its heat dissipation method, combining external air cooling and internal liquid cooling for the heat absorbing box

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