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Polyamideimide resin and single-sided conductive composite film prepared from same

A technology of polyamide-imide resin and polyamide-imide, applied in electrical components, magnetic field/electric field shielding, coating, etc., can solve the problem of difficult to meet the electromagnetic shielding requirements of optocoupler systems, low elongation at break, Low tensile strength and other problems, to achieve good electromagnetic shielding effect, adjustable strength and toughness, good light transmission effect

Active Publication Date: 2021-01-08
江苏慧智新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult for a single polymer substrate to meet the requirements of high strength and high toughness at the same time.
For example, although polyamideimide (PAI) has high mechanical strength, its toughness is poor (low elongation at break)
Polyurethane, on the other hand, has a higher elongation at break but a lower tensile strength
In addition, traditional electromagnetic shielding materials have low light transmittance, which makes it difficult to meet the electromagnetic shielding requirements of increasingly widespread optocoupler systems

Method used

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  • Polyamideimide resin and single-sided conductive composite film prepared from same
  • Polyamideimide resin and single-sided conductive composite film prepared from same
  • Polyamideimide resin and single-sided conductive composite film prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A transparent polyamide-imide resin with repeating units as shown in the following structure:

[0043]

[0044] Wherein 3000

[0045] A kind of preparation method of transparency polyamide-imide resin comprises the following steps:

[0046] (1) The synthesis of diacid monomer (ODPA-ABA), this reaction can be represented by following reaction formula:

[0047]

[0048] In a 100ml three-necked flask, add 4,4'-oxydiphthalic anhydride (ODPA) (3.1g, 0.01mol), 4-aminobutyric acid (ABA) (2.34g, 0.02mol) and 20ml acetic acid, in Under a nitrogen atmosphere, the temperature was slowly raised to 110° C., and the reaction was carried out for 11 hours. The reaction solution was cooled to room temperature, filtered to obtain white diacid monomer (ODPA-ABA) (3.49 g, 0.0082 mol), yield: 83%. NMR and infrared data: 1 H NMR (Trifluoroacetic acid-d, 500MHz, δ / ppm): 11.57(broad,COOH),7.90(dd,2H),7.50(d,2H),7.42(dd,2H),3.94(s,4H), 3.83(t,4H), 2.06(t,4H). FTIR (KBr,ν,cm ...

Embodiment 2

[0072] The difference from Example 1 is that when preparing the base layer, the mass ratio of the transparent polyamide-imide resin to the thermoplastic polyurethane is 1:0. The prepared single-sided conductive composite film has a tensile strength of 120MPa, a Young's modulus of 4700MPa, an elongation at break of 9.2%, and a light transmittance of 80%, exceeding 40dB in the range of 30Mhz-6GHz.

Embodiment 3

[0074] The difference from Example 1 is that when preparing the base layer, the mass ratio of the transparent polyamide-imide resin to the thermoplastic polyurethane is 0:1. The prepared single-sided conductive composite film has a tensile strength of 35MPa, a Young's modulus of 4.1MPa, an elongation at break of 1100%, and a light transmittance of 81%, exceeding 40dB in the range of 30Mhz-6GHz.

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Abstract

The invention discloses transparent polyamideimide resin. The transparent polyamideimide resin has a repeating unit as shown in a structure which is described in the specification. In the structure, nis more than 3000 and less than 7000. The invention further discloses a single-sided conductive composite film prepared from the polyamideimide resin. The single-sided conductive composite film sequentially comprises a conductive layer and a matrix layer from top to bottom, wherein the thickness of the matrix layer is 40-60 microns, and the thickness of the conductive layer is 5-10 microns. The single-sided conductive composite film provided by the invention has the advantages of high conductivity, adjustable strength and toughness and the like, can be attached to a bent surface, and can be applied to the field of flexible electronics.

Description

technical field [0001] The invention belongs to the technical field of preparation of nanocomposite materials, and in particular relates to a polyamide-imide resin and a single-sided conductive composite film prepared therefrom. Background technique [0002] With the development of society and the progress of science and technology, electronic products have become an indispensable part of people's life. The resulting electromagnetic pollution is becoming more and more serious. Therefore, electromagnetic shielding materials, especially electromagnetic shielding materials with excellent comprehensive performance, will have a broad market demand in the future. [0003] Polymer-based electromagnetic shielding materials are favored by people because of their light weight, good flexibility, and easy processing and molding. However, it is difficult for a single polymer substrate to meet the requirements of high strength and high toughness at the same time. For example, although ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J7/06C08J7/044C08J5/18C08L79/08C08L75/04H05K9/00
CPCC08G73/1071C08G73/1003C08J7/06C08J7/044C08J5/18H05K9/0092C08J2379/08C08J2475/04C08J2375/04
Inventor 王艳宾周永南
Owner 江苏慧智新材料科技有限公司
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