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Low-dielectric-constant high-frequency transmission hot melt adhesive and adhesive film and preparation method thereof

A low dielectric constant, high frequency transmission technology, applied in the field of hot melt adhesive, can solve the problems of reducing the service life of hot melt adhesive film, affecting the quality of hot melt adhesive film, large signal transmission loss, etc., to enhance mechanical strength and adhesion. Focus on, improve the dielectric properties, reduce the effect of dielectric loss and signal loss

Active Publication Date: 2021-01-08
中瀚新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Hot-melt adhesives produce adhesive force after cooling and solidification, and are thermoplastic. The chemical and physical properties of hot-melt adhesives will not be changed. They are widely used in printing, packaging, cables, electronic appliances and other fields, especially in cables, In the field of electronics, conventional hot-melt adhesives have large dielectric loss and signal transmission loss in high-frequency transmission. In addition, shrinkage of hot-melt adhesives during film formation will form defects such as shrinkage cavities, pinholes or surface pits, which affect thermal The quality of the melt adhesive film reduces the service life of the hot melt adhesive film

Method used

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  • Low-dielectric-constant high-frequency transmission hot melt adhesive and adhesive film and preparation method thereof
  • Low-dielectric-constant high-frequency transmission hot melt adhesive and adhesive film and preparation method thereof

Examples

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preparation example Construction

[0035] A second aspect of the present invention provides a method for preparing a low-dielectric constant high-frequency transmission hot-melt adhesive, comprising the following steps:

[0036] S1. According to the weight ratio, dissolve 30-50 parts of saturated polyester resin in 70-100 parts of a mixed solvent of butanone and toluene, the volume ratio of butanone and toluene is (2-3):1, and then add 20 ~30 parts of flame retardant, 5~10 fillers; first disperse at a speed of 1000~1500 rpm for 60~80 minutes, after the dispersion is uniform, use a grinder to grind to below 5 μm, and then disperse at a speed of 100~200 rpm 30-50 minutes to disperse to obtain A component;

[0037] S2. Dissolve 0.5-5 parts of curing agent in 10-20 parts of methyl ethyl ketone solvent, and stir evenly to obtain component B;

[0038] S3. Add the B component to the A component, add 1-5 leveling agents, and disperse at a speed of 200-500 rpm for 30-50 minutes to obtain the hot melt adhesive.

[0039...

Embodiment 1

[0045] Embodiment 1 provides a low-dielectric constant high-frequency transmission hot melt adhesive and its preparation method. The preparation raw materials include: 40 parts of saturated polyester resin, 3 parts of curing agent, 3 parts of leveling agent, flame retardant 25 parts of agent, 8 parts of filler.

[0046] The saturated polyester resin is a mixture of crystalline polyester resin and non-crystalline polyester resin, with a weight ratio of 9:1; the molecular weight of non-crystalline polyester resin is 30000, purchased from Shanghai Haoyang Industrial Development Co., Ltd., model for #673.

[0047] The crystalline polyester resin is a mixture of crystalline polyester resin A and crystalline polyester resin B, the weight ratio is 3:1, the glass transition temperature of the crystalline polyester resin A is 27°C, heat The melt viscosity is 1500dP·s, the molecular weight is 20000, purchased from Shanghai Haoyang Industrial Development Co., Ltd., model GA-1310; the gl...

Embodiment 2

[0059] Similar to Example 1, a low-dielectric constant high-frequency transmission hot-melt adhesive and its adhesive film and preparation method are provided, but in the hot-melt adhesive preparation raw materials, by weight, include: 30 parts of saturated polyester resin , 0.5 parts of curing agent, 1 part of leveling agent, 20 parts of flame retardant, 5 parts of filler.

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Abstract

The invention discloses a low-dielectric-constant high-frequency transmission hot melt adhesive, an adhesive film of the hot melt adhesive, a preparation method of the adhesive film and a preparationmethod of the hot melt adhesive. The hot melt adhesive is prepared from the following raw materials in parts by weight: 30-50 parts of saturated polyester resin, 0.5-5 parts of a curing agent, 1-5 parts of a leveling agent, 20-30 parts of a flame retardant and 5-10 parts of filler. The saturated polyester resin is a mixture of crystalline polyester resin and non-crystalline polyester resin, so that the dielectric constant of the hot melt adhesive film is reduced, the dielectric loss and the signal transmission loss in high-frequency transmission are reduced, the prepared hot melt adhesive alsohas good cohesiveness, and the hot melt adhesive film has excellent surface quality, aging resistance and flame retardancy.

Description

technical field [0001] The invention belongs to the field of hot-melt adhesives, in particular to a hot-melt adhesive for high-frequency transmission with low dielectric constant, an adhesive film and a preparation method thereof. Background technique [0002] Hot melt adhesive is a solid adhesive made of thermoplastic resin or elastomer as base material, adding tackifier, plasticizer, flame retardant and filler, and melting and mixing. Hot-melt adhesives produce adhesive force after cooling and solidification, and are thermoplastic. The chemical and physical properties of hot-melt adhesives will not be changed. They are widely used in printing, packaging, cables, electronic appliances and other fields, especially in cables, In the field of electronics, conventional hot-melt adhesives have large dielectric loss and signal transmission loss in high-frequency transmission. In addition, shrinkage of hot-melt adhesives during film formation will form defects such as shrinkage ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J167/00C09J11/04C09J11/06C09J11/08C09J7/35
CPCC08K2003/2241C08K2003/387C08K2201/014C08L2201/08C08L2205/02C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C09J167/00C09J2467/00C09J2483/00C09J7/35C08L67/00C08L83/04C08L83/12C08K13/04C08K7/26C08K3/22C08K5/29C08K3/38
Inventor 宁珅黄志远童军付静
Owner 中瀚新材料科技有限公司