Anti-battery effect isolation dielectric paste for thick film circuit

A technology for isolating medium and battery effect, applied to circuits, heterogeneous insulating materials, electrical components, etc., can solve problems such as battery effect and product failure, achieve low pollution, improve stability, and improve chemical stability Effect

Active Publication Date: 2021-12-21
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of battery effect in the use process of the existing isolation medium slurry for thick film circuits, resulting in product failure, and to provide a product with excellent resistance to battery effect, good printability, dense firing film layer, and breakdown voltage resistance Isolation dielectric paste for thick film circuits with high insulation resistance and low dielectric constant

Method used

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  • Anti-battery effect isolation dielectric paste for thick film circuit
  • Anti-battery effect isolation dielectric paste for thick film circuit
  • Anti-battery effect isolation dielectric paste for thick film circuit

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Embodiment

[0028] Preparation of micron-sized anorthite: After crushing the anorthite ore with a crusher, sieve it with an 80-mesh stainless steel screen, take the undersieve, and then roast it at 800°C for 2 hours, and then ball mill it to a particle size of 1 ~1.3 μm.

[0029] Preparation of glass powder: According to the ratio of oxides listed in Table 1, melting temperature and holding time, after mixing various oxides evenly, the resulting mixture is placed in a melting furnace for melting, and the obtained glass solution is water-quenched to obtain Glass: crush the glass into glass slag, grind the glass slag into a particle size of 1.0-1.3 μm with a ball mill, and dry it to obtain glass powder.

[0030] Table 1 glass powder formula and process parameters

[0031]

[0032] Note: Glass 9 in the table uses Bi 2 o 3 Top up to 100%.

[0033] Preparation of organic carrier: Stir 70g of terpineol and 2g of soybean lecithin in a beaker and heat to 70°C, then add 5g of ethyl cellulos...

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PUM

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Abstract

The invention discloses an anti-battery effect isolation medium slurry for a thick film circuit. The medium slurry comprises the following components in mass percentages: 60%-75% of glass powder, 3%-12% of additives, and 1% of inorganic pigments ~5%, organic vehicle 20%~35%, among which the glass powder is composed of ZnO, CaO, Al 2 o 3 , SiO 2 , B 2 o 3 , TeO 2 Composition, the additives are composed of micron-sized anorthite, α-type nano-alumina, nano-ZrO 2 Composition, the micron grade anorthite ore is made by crushing anorthite ore, sieving through an 80-mesh sieve, and then roasting at 750-800°C for 1-3 hours, and then ball milling to a particle size of 1-2 μm after natural cooling. to make. The anti-battery effect isolation medium paste for thick film circuits of the present invention has the characteristics of excellent anti-battery effect, good printability, dense firing film layer, high breakdown voltage resistance, high insulation resistance and small dielectric constant.

Description

technical field [0001] The invention belongs to the technical field of slurry for thick-film circuits, and in particular relates to a battery-effect-resistant isolation medium slurry for thick-film circuits. Background technique [0002] With the development of microelectronic packaging technology, the scope of use of thick-film hybrid integrated circuits has gradually expanded, and high-integration, high-performance, and high-quality ceramic circuit boards can be prepared using thick-film technology. Thick-film circuit devices have begun to develop in the direction of miniaturization, integration, and high frequency, so that the product wiring density is higher, the volume is smaller, and it can be applied to a wider frequency range. The dielectric paste is required to have better resistance to battery effect, higher dielectric strength, lower dielectric loss, and meet the requirements for multi-layer wiring. [0003] At present, in high-reliability thick-film circuit prod...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B3/00H01L27/01C03B19/10C03C12/00
CPCH01B3/006H01L27/013C03C12/00C03B19/1005
Inventor 鹿宁王要东赵莹雷莉君陆冬梅孙社稷王妮殷美
Owner 西安宏星电子浆料科技股份有限公司
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