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Flower type boiling heat transfer structure and preparation method thereof

A boiling heat transfer and patterning technology, applied in nanotechnology, nanotechnology for materials and surface science, nanotechnology, etc., can solve problems such as low critical heat flux density, and achieve easy reaction, simple process and excellent boiling exchange. The effect of thermal properties

Inactive Publication Date: 2021-01-12
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] An object of the present invention is to provide a flower-shaped boiling heat transfer structure for solving the problem of low critical heat flux in the prior art

Method used

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  • Flower type boiling heat transfer structure and preparation method thereof
  • Flower type boiling heat transfer structure and preparation method thereof
  • Flower type boiling heat transfer structure and preparation method thereof

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preparation example Construction

[0045] In one embodiment of the present application, a method for preparing a flower-shaped boiling heat transfer structure is provided, including: taking copper as a working electrode, placing a counter electrode and a reference electrode in a weakly alkaline copper salt electrolyte system to form a reducing system, and A reduction current is applied between the working electrode and the counter electrode, and the main structure of the copper microcone is formed by electroplating; then the copper microcone is used as the working electrode, the counter electrode and the reference electrode are placed in a weakly acidic nickel salt electrolyte system to form a reduction system, A reduction current is applied between the working electrode and the counter electrode, and the electrodeposition reaction of nickel is carried out on the copper micro-cone, thereby forming a micro-nano porous film on the surface of the copper material.

[0046]In a preferred embodiment, the weakly acidic...

Embodiment 1

[0053] This example relates to a flower-shaped copper-nickel micro-nanoporous structure prepared by electrochemical deposition for efficient boiling heat transfer. combine figure 1 As shown, the specific steps are as follows:

[0054] (1) Polish the surface of the copper test piece, rinse it with ultrapure water, and dry it with high-purity nitrogen. This step is to remove the surface oxide layer.

[0055] (2) The copper test piece processed in step (1) is used as the working electrode, placed in the weakly alkaline copper salt electrolyte solution, the platinum electrode is used as the counter electrode, and the silver / silver chloride is used as the reference electrode. The working electrodes are connected by wires, and a loop is formed between the counter electrode and the reference electrode. The distance between the two electrodes is controlled to be 60mm, and the constant voltage electrodeposition reaction is carried out in a constant temperature water bath at 75°C. Th...

Embodiment 2

[0063] This example relates to a flower-shaped copper-nickel micro-nano porous structure prepared by electrochemical deposition, which is used to enhance boiling heat transfer. Specific steps are as follows:

[0064] (1) Polish the surface of the copper test piece, rinse it with ultrapure water, and dry it with high-purity nitrogen. This step is to remove the surface oxide layer.

[0065] (2) The copper test piece processed in step (1) is used as the working electrode, placed in the weakly alkaline copper salt electrolyte solution, the platinum electrode is used as the counter electrode, and the silver / silver chloride is used as the reference electrode. The working electrodes are connected by wires, and a loop is formed between the counter electrode and the reference electrode. The distance between the two electrodes is controlled to be 60mm, and the constant voltage electrodeposition reaction is carried out in a constant temperature water bath at 75°C. The voltage is contro...

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Abstract

The invention discloses a flower type boiling heat transfer structure and a preparation method thereof. The surface of the structure is covered with a micro-nano porous membrane, the micro-nano porousmembrane takes copper micron cones as a main body, and the surfaces of the copper micron cones are coated with nano cones to form graded composite cone structures; and unique micro-nano porous structures are formed among the composite cone structures. Compared with a single copper micron cone structure, the flower type boiling heat transfer structure of the invention has a larger heat exchange area, far more nucleation sites, more excellent boiling heat transfer performance, a higher boiling heat transfer coefficient and higher critical heat flux density, and the degree of superheat corresponding to a nucleate boiling starting point is lower. The electrolyte required for preparing the flower type boiling heat transfer structure is simple in formula, economical and easy to obtain, wide inthe selectable range of an electroplating mode, and suitable for industrial large-scale application.

Description

technical field [0001] The invention belongs to the technical field of nanometer materials, and in particular relates to a flower-shaped boiling heat transfer structure and a preparation method thereof. Background technique [0002] With the development of miniaturization, integration, and high power of electronic devices, a severe test is put forward for high heat flow heat dissipation. Using existing or developing new micro-nano processing technology to develop micro-nano copper materials with better boiling heat transfer performance has become the focus of current research. [0003] In 2008, the team of Professor Toprak of the Royal Institute of Technology used the electrochemical deposition method to prepare a three-dimensional copper dendritic nanocomposite microporous structure on the surface of copper and confirmed that it has efficient boiling heat transfer performance (Adv.Funct.Mater.,2008,18 , 2215–2220). This structure itself is prepared by using dynamic bubble...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38B82Y40/00B82Y30/00
CPCB82Y30/00B82Y40/00C25D3/38
Inventor 高雪峰吴菲菲泽花姐
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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