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Processing technology of polyimide film

A polyimide film and processing technology technology, applied in the field of polyimide film, can solve the problems of affecting the comprehensive performance of composite materials, difficult to achieve nano-scale composite, large specific surface area and surface energy, etc. Rapid dissipation, enhanced film surface heat transfer, enhanced corona resistance life

Inactive Publication Date: 2021-01-29
潍坊弘润新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the specific surface area and surface energy of the existing nanoparticles are large, and there is a strong interaction between the particles, which is prone to agglomeration. Comprehensive properties of materials

Method used

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Embodiment Construction

[0022] The following clearly and completely describes the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them.

[0023] implementation

[0024] A kind of processing technology of polyimide film, comprises the following steps:

[0025] S1: Prepare 1-10 parts of 4,4'-diaminodiphenyl ether and 1-10 parts of 3,3',4,4'-benzophenone tetracarboxylic dianhydride, prepare 5-10 parts of N , N-dimethylformamide, prepare 10-20 parts of aluminum oxide, silicon dioxide and boron nitride;

[0026] S2: Prepare a reactor with nitrogen protection, put 6-8 parts of N,N-dimethylformamide into the reactor, and open the reactor, the stirring device in the reactor is suitable for N,N-dimethylformamide The amide is pre-stirred, and then 2-5 parts of 4,4'-diaminodiphenyl ether are added for stirring;

[0027] S3: Add 2-5 parts of 3,3',4,4'-benzophenone tetracarboxylic dia...

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Abstract

The invention belongs to the field of polyimide films, relates to a processing technology of a polyimide film, and aims to solve the problems that existing nanoparticles are large in specific surfacearea and surface energy, relatively strong in interaction among the particles and easy to agglomerate, and the problem that ideal nanoscale compounding is difficult to achieve between the nanoparticles and polymers with relatively high viscosity. In order to solve the problem that the comprehensive performance of a composite material is influenced, the invention provides the following technical schemes, the processing technology of the polyimide film comprises the following steps that: S1, preparing 1-10 parts of 4, 4'-diaminodiphenyl ether and 1-10 parts of 3, 3', 4, 4 '-benzophenonetetracarboxylic dianhydride, preparing 5-10 parts of N, N-dimethylformamide, and preparing 10-20 parts of aluminum oxide, silicon dioxide and boron nitride; and S2, preparing a reactor with nitrogen protection. The processing technology of the polyimide film is better improved; the corona resistance of the polyimide film is higher; the tensile resistance of the polyimide film is better; and the service life of the polyimide film is longer.

Description

technical field [0001] The invention relates to the technical field of polyimide films, in particular to a processing technology of polyimide films. Background technique [0002] Polyimide film is a new type of high temperature resistant organic polymer film, it has high modulus, low shrinkage, high strength, low water absorption, hydrolysis resistance, radiation resistance, non-toxic, excellent insulation and thermal oxidation resistance Stability, because it is one of the most expensive film materials in the world, it is called "golden film". It is a key insulating material for electric appliances and a key material for microelectronics manufacturing and packaging; [0003] However, the specific surface area and surface energy of the existing nanoparticles are large, and there is a strong interaction between the particles, which is prone to agglomeration. Comprehensive performance of materials. Contents of the invention [0004] The purpose of the present invention is ...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08K3/22C08K3/36C08K3/38C08J5/18C08L79/08
CPCC08G73/1071C08G73/1007C08K3/22C08K3/36C08K3/38C08J5/18C08J2379/08C08K2003/2227C08K2003/385C08K2201/001C08K2201/011
Inventor 孙大山张春蕾范树娟李明张财王国力石少伟
Owner 潍坊弘润新材料有限公司
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