Chip packaging structure and packaging method

Abstract

The invention provides a chip packaging structure which is used for measuring parameters of a to-be-measured water body and comprises a sensor chip and a base plate. The sensor chip comprises a glasssubstrate, wherein a plurality of electrodes are formed on the glass substrate and used for measuring multiple parameter values of the to-be-measured water body; a silicon substrate bonded with the glass substrate; and a plurality of chip welding spots formed on the glass substrate; wherein the base plate is bonded with the sensor chip, the base plate is provided with a plurality of electric connecting parts, one end of each electric connecting part is electrically connected with a chip welding spot, the other end of each electric connecting part is electrically connected with a terminal, andthe sensor chip is used for measuring a plurality of parameter values of the to-be-measured water body and transmitting the parameter values to the terminal through the electric connecting parts. Theinvention further provides a chip packaging method. According to the invention, the transmission performance of the sensor chip can be improved, and the service life is prolonged.

Description

technical field [0001] The present application relates to the field of chip technology, and in particular to a chip packaging structure and a chip packaging method. Background technique [0002] Temperature, conductivity, and pH parameters are the main parameters of the water environment. The temperature / conductivity / pH three-parameter integrated sensor chip is a method that converts temperature, conductivity, and pH value signals into electrical signals, and then stores the electrical signals after further processing. , to display the device. This type of sensor chip is widely used in ocean, surface water and drinking water monitoring and analysis. At present, the hydrogen ion selective electrode used for sensing the pH value in this type of sensor chip is mainly formed of metal oxide, which can be completed by the metal sputtering process in the MEMS (micro-electromechanical system) manufacturing process, and the integration effect can be achieved. And reduce the cost an...

AI Technical Summary

Problems solved by technology

In the process of realizing the present invention, the inventors found that there are at least the following problems in the prior art: because the sensor chip produced by the MEMS process is only suitable for some common occasions, it is easily affected by corrosion and pollutant adhesion in relatively harsh water environments In addition, the chip solder joints of the existing sensor chips are relatively small. If the smaller chip solder joints are directly used to weld the terminal pins for information transmission, there will be a problem of unstable transmission performance, making it difficult for the sensor to achieve the desired effect.

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