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Arylsilane compound, arylsilane polymer and application thereof

A technology of aryl silanes and compounds, applied in the field of organic electroluminescence, can solve problems such as difficult dissolution, achieve excellent luminescent performance, reduce interaction, and avoid quenching effects

Pending Publication Date: 2021-02-09
GUANGDONG JUHUA PRINTING DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A common solution is to use an orthogonal solvent system, but commonly used organic small molecule materials usually have good solubility in commonly used organic solvents, and it is difficult to ensure that the solvent used in the latter layer will not affect the deposition of the previous layer. material causing dissolution

Method used

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  • Arylsilane compound, arylsilane polymer and application thereof
  • Arylsilane compound, arylsilane polymer and application thereof
  • Arylsilane compound, arylsilane polymer and application thereof

Examples

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preparation example Construction

[0096] Preparation method of organic light emitting diode device:

[0097](1) First, clean the ITO substrate in the following order: 5% KOH solution ultrasonication for 15 minutes, pure water ultrasonication for 15 minutes, isopropanol ultrasonication for 15 minutes, and oven drying for 1 hour; then transfer the substrate to UV-OZONE equipment for surface treatment for 15 minutes. Immediately transfer to the glove box. Spin-coat a layer of hole-injection layer material, namely PEDOT:PSS film, on a clean ITO substrate, and then bake at 230° C. for 15 minutes. A layer of HTL film, ie VNPB, was spin-coated on the hole injection layer, and the film was baked at 200° C. for 30 minutes after the film was formed by spin coating.

[0098] (2) Dissolve the host material raw material and the guest material with the solvent methyl benzoate, and then make a mixed solution in such a way that the mass of the guest material accounts for 7% of the sum of the mass of the host material raw mat...

Embodiment 1

[0102] The monomer compound M1 is used as the raw material of the cross-linked host material (crosslik-M), and the Ir(ppy) 2 Acac is used as a guest material, and an organic light emitting diode device 1 is prepared according to the above-mentioned method for preparing an organic light emitting diode device.

Embodiment 2-7

[0104] The monomer compound M2-7 is used as the raw material of the cross-linked host material, and the Ir(ppy) 2 Acac was used as the guest material, and organic light emitting diode devices 2-7 were prepared according to the above-mentioned method for preparing organic light emitting diode devices.

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Abstract

The invention relates to an arylsilane compound, an arylsilane polymer and application thereof. The structural formula of the arylsilane compound is shown as a formula I in the specification. The arylsilane compound takes an aryl unit as a core, an aryl silane unit as an arm and a vinyl double bond as an end group, can be dissolved by a conventional solvent at normal temperature, and can form a cross-linked main body material layer insoluble in the conventional solvent in a thermal cross-linking manner after film formation, the cross-linked main body material layer is insoluble in the conventional solvent, is not easy to dissolve by a solvent of a next functional layer, and is suitable for preparing an OLED device by a solvent film-forming method.

Description

technical field [0001] The invention relates to the technical field of organic electroluminescence, in particular to aryl silane compounds, aryl silane polymers and applications thereof. Background technique [0002] An organic light-emitting diode (Organic Light-Emitting Diode, OLED) is prepared by stacking a carrier injection layer, a carrier transport layer and a light emitting layer. Due to its many advantages, OLED devices have been widely studied and applied in flat panel display devices and solid-state lighting sources. The traditional preparation method of OLED devices mainly adopts vacuum evaporation to form a film, but its cost is high and it is not suitable for large-scale production. Solution processing to prepare OLED devices has higher application value in the preparation of large-area light-emitting and display devices because it can prepare large-size OLED display panels at low cost and in a large area. [0003] However, during the preparation of OLED devic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07F7/08C08F30/08H01L51/50H01L51/54H01L51/05H01L51/30H01L51/42H01L51/46
CPCC07F7/0805C08F30/08H10K10/00H10K85/40H10K30/00H10K50/11Y02E10/549
Inventor 郑江波
Owner GUANGDONG JUHUA PRINTING DISPLAY TECH CO LTD
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