Method for improving cutting force of polishing powder

A polishing powder and cutting force technology, applied in the field of polishing powder, can solve the problems of decreased polishing efficiency, short service life, poor self-sharpening of polishing powder, etc., so as to prolong the service life, alleviate the passivation phenomenon, and improve the self-sharpening. The effect of strong performance and cutting force

Inactive Publication Date: 2021-02-09
云南光电辅料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the existing polishing powder is not self-sharpening, and there is an obvious passivation phenomenon in the polishing process, that is, the polishing efficiency is high in the early stage. As the use time continues, although the polishing powder is not lost, the polishing efficiency drops rapidly, and it needs to be continuously polished. Add new polishing powder, the service life is not long

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] The steps of this embodiment are as follows:

[0017] (1) Put 3 kg of cerium oxide polishing powder with a particle size D50 of 10 µm into the crucible; (2) Put the crucible in a box-type muffle furnace and heat it up to 1000°C, and burn it for 2 hours; (3) Stirring conditions Pour the burned powder into 50 liters of zinc nitrate aqueous solution with a temperature of 20°C and a percentage concentration of 6% within 10 seconds, and disperse evenly within 30 seconds; (5) Stand still and precipitate , solid-liquid separation, and the precipitate is washed with deionized water, and dried to obtain high cutting force cerium oxide polishing powder.

[0018] The resulting high cutting force cerium oxide polishing powder and the untreated cerium oxide polishing powder were added to deionized water to make a polishing solution with a mass percentage of 8%, and the K9 optical glass was treated at a speed of 800r / min and a pressure of 0.1MPa. Test piece is carried out polishing ...

Embodiment 2

[0020] The steps of this embodiment are as follows:

[0021] (1) Put 2 kg of alumina polishing powder with a particle size D50 of 5 µm into the crucible; (2) Put the crucible in a box-type muffle furnace and heat it up to 1500 ° C, and burn it for 1 hour; (3) Stirring conditions Next, pour the burned powder into 40 liters of room temperature deionized aqueous solution with a concentration of 1% polyvinyl alcohol and a concentration of 4% zinc nitrate within 15 seconds, and disperse evenly within 30 seconds; (5) Stand still, precipitate, and separate solid and liquid, and the precipitate is washed with deionized water, and dried to obtain high cutting force cerium oxide polishing powder.

[0022] The processed high-cutting force alumina polishing powder and the untreated alumina polishing powder were added to deionized water to make a polishing liquid with a mass percentage of 10%, and the sapphire specimen was treated at a speed of 1000r / min and a pressure of 0.15MPa. Test pi...

Embodiment 3

[0024] The steps of this embodiment are as follows:

[0025] (1) Put 2 kg of cerium oxide polishing powder with a particle size D50 of 10 μm into the crucible; (2) place the crucible in a box-type muffle furnace and fill it with nitrogen, raise the temperature to 1100 ° C, and burn for 1 hour; (3 ) under stirring conditions, pour the burnt powder into 50 liters of deionized aqueous solution at 20°C within 10 seconds, and disperse evenly within 30 seconds; (5) Stand still, precipitate, solid-liquid Separation, cleaning the precipitate with deionized water, and drying to obtain high cutting force cerium oxide polishing powder.

[0026] The resulting high-cutting force cerium oxide polishing powder and the untreated cerium oxide polishing powder were added to deionized water to prepare a polishing solution with a mass percentage of 10%, and the plate glass was tested at a speed of 800r / min and a pressure of 0.1MPa Polishing test is carried out on each piece, embodiment 1 deals w...

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PUM

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Abstract

The invention discloses a method for improving the cutting force of polishing powder, and the method comprises the following steps: (1) heating the polishing powder to 800-1,300 DEG C, and keeping thetemperature for 1.5-4 hours; (2) rapidly cooling the polishing powder in a water cooling or oil cooling mode, wherein the cooling speed is higher than 500 DEG C/20 seconds; (3) cleaning and drying toobtain the high-self-sharpening polishing powder. The ooling water for water cooling is one of tap water, deionized water, tap water with the cooling medium mass percentage concentration of 1-15% ora deionized water solution; cooling oil for oil cooling is prepared from one or a composition of more of 150N, 250N, 350N, 400N and 500N base oil, and polyisobutene which accounts for 2-6% of the weight of the base oil and has the low molecular weight of 680-3,400, wherein the polyisobutene accounts for 2-6% of the weight of the base oil. By adopting the method disclosed by the invention to treatthe polishing powder, the self-sharpening property and the cutting force of the polishing powder can be improved, and the passivation phenomenon in the polishing process is relieved, so that the service life of the polishing powder is prolonged.

Description

technical field [0001] The invention relates to the technical field of polishing powder, in particular to a method for improving the cutting force of polishing powder. Background technique [0002] Different from mechanical grinding, the surface polishing mechanism represented by optical components is very complicated, and there is no unified understanding in the industry. It is generally believed that in addition to mechanically removing the raised parts of the workpiece to be polished by polishing materials, a smooth surface is obtained; there are also polishing materials After acting on the convex part of the workpiece to be polished, the convex part of the workpiece to be polished will undergo plastic deformation and flow, and a smooth surface will be obtained; if water exists during polishing, it is considered that chemical reactions such as hydrolysis have occurred. Most of the polishing materials are powders, referred to as polishing powders. The common chemical compo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 马杰句红兵杨玉萍杨俊宏谭立
Owner 云南光电辅料有限公司
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