A high-power vcsel array chip flip-chip packaging structure and preparation method

Abstract

The invention discloses a high-power VCSEL array chip flip-chip packaging structure and a preparation method, comprising: a bottom emission two-dimensional periodic VCSEL array chip, a heat sink and a multi-layer single crystal reflection film layer; a bottom emission two-dimensional periodic VCSEL The array chip includes a substrate layer and a two-dimensional periodic VCSEL light-emitting unit arranged at the bottom of the substrate layer; the bottom of the VCSEL light-emitting unit is connected to the heat sink through a solder layer, and the top of the substrate layer is provided with a multi-layer single crystal reflective film layer; wherein, the thermal The thermal expansion coefficient of the sink is equivalent to that of the substrate layer, and the single crystal reflective film layer has the same lattice structure as the substrate layer. The thermal expansion coefficient of the heat sink of the present invention is equivalent to the thermal expansion coefficient of the substrate layer of the VCSEL array chip, which can reduce the internal thermal stress of the chip and inhibit the deformation of the chip when heated; prepare a multi-layer monolayer on the top of the substrate layer that matches the lattice of the substrate layer. The crystal film layer improves the adhesion between the single crystal reflective layer and the substrate layer.

Description

technical field [0001] The invention relates to the technical field of semiconductor laser chips, in particular to a high-power VCSEL array chip flip-chip packaging structure and a preparation method. Background technique [0002] Compared with edge-emitting semiconductor lasers, vertical cavity surface-emitting lasers (VCSEL) have superior performance such as small size, circular spot, low threshold current, single longitudinal mode output, high coupling efficiency, and easy two-dimensional array integration. Power VCSELs are widely used in laser printing, laser medical treatment, chip lithography, welding processing and other fields. [0003] The VCSEL array chip improves the problem of poor beam quality of semiconductor lasers, but because the light-emitting unit of the traditional front-mounted VCSEL array chip packaging process is located on the top of the substrate layer, it cannot be in direct contact with the heat sink, and the heat dissipation effect is poor, result...

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Problems solved by technology

[0003] The VCSEL array chip improves the problem of poor beam quality of semiconductor lasers, but because the light-emitting unit of the traditional front-mounted VCSEL array chip packaging process is located on the top of the substrate layer, it cannot be in direct contact with the heat sink, and the heat dissipation effect is poor, resulting in unstable work efficiency. Limits the development and application of high-power VCSEL arrays

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