Electronic packaging shell and preparation method thereof

Abstract

The invention discloses an electronic packaging shell and a preparation method thereof, and relates to the field of electronic packaging, the electronic packaging shell is simple in structure, the electronic packaging shell is composed of an annular frame and a bottom plate, the welding surfaces of the annular frame and the bottom plate are plated with plating layers, the annular frame and the bottom plate can be connected in a brazed mode, and the welding intensity of the annular frame and the bottom plate is improved to a certain degree. The bottom plate of the electronic packaging shell ismade of an aluminum silicon carbide material, so that the bottom plate of the electronic packaging shell is good in heat dissipation and low in linear expansion coefficient, and meanwhile, the material of the annular frame for forming the electronic packaging shell is easy to obtain and process. By the adoption of the manufacturing method of the electronic packaging shell, the defect that aluminumsilicon carbide is high in hardness and difficult to machine can be overcome, the whole manufacturing process is simple and easy to implement, and mass production is easy.

Description

technical field [0001] The invention relates to the field of electronic packaging, in particular to an electronic packaging shell and a preparation method thereof. Background technique [0002] The electronic packaging shell is the outer package of a device (a typical device such as a hybrid integrated circuit). It is an important part of the device. It is assembled and packaged with the internal chips, resistors, capacitors and other electronic components and circuit substrates to form a complete package. , Electronic devices with specific functions. [0003] In the field of electronic packaging, with the continuous reduction of component volume and continuous increase of frequency, the degree of integration of devices is getting higher and higher, and the power is increasing. The heat dissipation performance and linear expansion coefficient of the bottom (circuit substrate mounting area), etc. In addition, the amount of electronic devices is increasing year by year, and m...

AI Technical Summary

Problems solved by technology

[0004] Traditional electronic packaging shells are generally made of metal materials, with high material density, poor heat dissipation, and large linear expansion coefficient, which can no longer meet the development needs of shells.

As a new type of metal matrix composite material, aluminum silicon carbide has the advantages of low density, good heat dissipation, and low linear expansion coefficient (close to the expansion coefficient of ceramic substrates commonly used in circuit devices), but the hardness of aluminum silicon carbide materials is second only to that of diamond. Silicon carbide particles, which cannot be processed by ordinary milling cutters, have poor machining performance, and it is difficult to form the shell of the cavity. It is suitable for processing with a grinding machine to make plate-shaped components.

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