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Improvement method applied to solder mask hole plugging after tin spraying of PCB

A technology for solder masking and hole plugging, which is used in secondary processing of printed circuits, electrical components, and printed circuit manufacturing. Quality problems, improve the effect of component surface short circuit, and reduce process cost problems

Pending Publication Date: 2021-02-23
高德(江苏)电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For printing solder paste, if the hole at this position is designed as a through hole, the solder paste will easily flow to the other side, resulting in a short circuit of the weldment and causing reliability problems. Therefore, this type of hole is usually designed as a solder mask half plug hole.
[0003] In the production of PCB products, the cost of HASL products with surface treatment is lower than that of other types of surface treatment products. Therefore, for most low-end consumer products, HASL is used, but HASL half-plug holes If the hole of the product is plugged before tin spraying, tin liquid will flow into the hole when spraying tin. For the board, when the customer goes online through reflow soldering, the tin beads melt in the hole and the air expands and contracts under the action of heat and cold. Therefore, the method of plugging holes after tin is often used, but plug holes after tin are prone to the problems of plug hole ink protrusion and plug hole ink pads, so it is necessary to optimize and design the solder mask process to improve related problems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] 1.1. Confirm whether the PCB product is half plugged;

[0024] 1.2. Spray tin on the surface of the PCB product;

[0025] 1.3. For the position of the half plug hole after spraying tin, make a solder-proof plug hole, use a screen mesh screen of 200 mesh for the solder-proof plug hole, and use a conventional plug hole ink for the plug hole ink;

[0026] 1.4. Pre-bake the PCB product behind the solder-proof plug hole, and the pre-baking parameter is 75 degrees Celsius for 50 minutes;

[0027] 1.5. Solder mask exposure of pre-baked PCB products, the exposure data are prepared as follows:

[0028] a. Confirm the position of the solder mask half plug hole;

[0029] b. The solder mask of the half-plug hole is not windowed. The position of the half-plug hole is designed to be a non-window (exposure light-transmitting point) according to the size of the half-plug hole plus 2 mil on one side, and the solder mask design of other positions is fully open window;

[0030] c. The...

Embodiment 2

[0036] In step b, the position of the half-plug hole for the solder mask is designed to be non-opening according to the size of the half-plug hole plus 3 mils on one side, and other operations are the same as those in the first embodiment.

[0037] The invention only adjusts the PCB products with solder-resistant half-plug hole design on the surface treatment of tin spraying, and only adjusts the number of solder-proof plug holes and the design method of solder-proof exposure data, without increasing any process cost; reducing the improvement of direct resin plug holes The process cost of tin plugging has improved the quality problem of soldering on the ink pads after tin plugging.

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PUM

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Abstract

The invention belongs to the technical field of PCB production, and particularly relates to an improvement method applied to solder mask hole plugging after tin spraying of a PCB. The method comprisesthe following steps: product information confirmation, solder mask printing data design after tin spraying, exposure data design after tin spraying, solder mask exposure negative film manufacturing and product conventional printing, product special parameter pre-drying, and product conventional development. According to the method, a problem of element surface short circuit caused by a fact thata client side backflow solder ball is sprayed out of the hole due to tin hole blocking caused by half hole plugging before tin spraying is solved, the process cost problem of improving tin hole blocking through direct resin hole plugging is reduced, and the problem that welding quality is affected by a bonding pad on hole plugging ink after tin spraying is solved; and the method is suitable for processing the surfaces of all PCB products into products with semi-plug hole requirements for tin spraying.

Description

technical field [0001] The invention belongs to the technical field of PCB board production, and in particular relates to an improved method for preventing solder plug holes after tin spraying on PCBs. Background technique [0002] With the continuous development of science and technology and the continuous improvement of people's living standards, the development of electronic products has gradually prospered, and electronic products have increasingly affected people's lives. Electronic assembly technology with printed circuit board (PCB) as the skeleton It is also slowly rising. In the electronic assembly technology, a large number of solder patch processes are used. In order to ensure the continuity and good heat dissipation effect of the solder patch of PCB products, mechanical drilling + holes will be used under the patch weld. The copper electroplating process ensures its conduction and heat dissipation; in order to ensure sufficient connection and conduction, a layer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/28
CPCH05K3/0094H05K3/282
Inventor 崔居民
Owner 高德(江苏)电子科技股份有限公司
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