Multilayer PCB laminated cover plate and preparation method thereof

Abstract

The invention discloses a multilayer PCB laminated cover plate which comprises an aluminum plate and a resin layer solution, and the resin layer solution is composed of the following raw materials inparts by weight: 40-50 parts of formaldehyde powder, 40-50 parts of phenol powder and 8-15 parts of oxalic acid, and the resin layer solution comprises the following components in specific parts by weight: 45 parts of formaldehyde powder, 45 parts of phenol powder and 10 parts of oxalic acid; and according to the multilayer PCB laminated cover plate, the aluminum plate and the resin are compoundedin an injection molding mode, compared with a traditional coating mode, the thickness and the size precision of the resin are high, bubbles can be completely filled through mold pressure, the hollowing phenomenon is avoided, the flatness is better, the later-period polishing and calibration procedures are reduced, the phenomena that a drill bit is likely to break and scratch a multilayer PCB areeffectively solved, the resin solution is prepared from 45 parts of formaldehyde powder, 45 parts of phenol powder and 10 parts of oxalic acid, and compared with traditional UV resin, the resin solution has the advantages of being better in high-temperature resistance, low in hygroscopicity, not prone to deformation and enough in softness, and further protects the drill bit.

Description

technical field [0001] The invention relates to the technical field of PCB laminated cover boards, in particular to a multilayer PCB laminated cover board, in particular to a multilayer PCB laminated cover board and a preparation method thereof. Background technique [0002] A multi-layer PCB board is a multi-layer wiring layer. There is a dielectric layer between each two layers. There are at least three conductive layers, two of which are on the outer surface, and the remaining layer is synthesized in the insulating board. The multi-layer PCB board is in Drilling is required during processing, and in order to avoid burrs and protect laminates and drills when drilling, a cover plate is usually covered on the top surface of the multi-layer PCB, which can effectively avoid burrs and protect laminates and drills; [0003] The existing multi-layer PCB laminated cover has certain deficiencies in processing. First of all, the traditional multi-layer PCB laminated cover is usually...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a multi-layer PCB laminated cover, which solves the problem that the aluminum plate and the resin in the traditional multi-layer PCB laminated cover are usually processed by coating, but there are surface problems in the coating method. Unstable phenomena such as unevenness and many bubbles are likely to cause drill bit breakage and scratches on the laminate during processing, and the manufacturing process error is relatively large; secondly, the surface of the traditional multi-layer PCB laminated cover board is usually The use of UV resin has the phenomena of low temperature resistance, high hygroscopicity and easy deformation, which is easy to cause errors in drilling, resulting in technical problems affecting the quality of the entire multi-layer PCB board; in the present invention, the polished aluminum plate is placed into the mold, then put the resin layer solution into the extruder, close the mold, and easily squeeze the resin layer into the mold through the extruder. After the resin layer solution is solidified, open the mold and take out the aluminum plate. Compared with the traditional coating method, the solution bonding method has the thickness of the resin and high dimensional accuracy, and the mold pressure can make the air bubbles be filled completely, avoiding hollowing, better flatness, and reducing later grinding and calibration The process effectively solves the phenomenon that the drill bit is easy to break and scratches the multi-layer PCB. The resin solution is made of 45 parts of formaldehyde powder, 45 parts of phenol powder and 10 parts of oxalic acid, which is more resistant to high temperature than traditional UV resin. At the same time, it also has the effect of low moisture absorption and not easy to deform, and it is soft enough to further protect the drill bit