Multilayer PCB laminated cover plate and preparation method thereof

A technology of gland and aluminum plate, which is applied in other household appliances, printed circuit manufacturing, electrical components, etc., can solve the problems of high temperature resistance, drilling error, uneven surface, etc., achieve high temperature resistance, solve the problem of easy breakage, The effect of high dimensional accuracy
CN112454958APending Publication Date: 2021-03-09深圳市瀚鼎电路电子有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
深圳市瀚鼎电路电子有限公司
Publication Date
2021-03-09
Patent Text Reader

Abstract

The invention discloses a multilayer PCB laminated cover plate which comprises an aluminum plate and a resin layer solution, and the resin layer solution is composed of the following raw materials inparts by weight: 40-50 parts of formaldehyde powder, 40-50 parts of phenol powder and 8-15 parts of oxalic acid, and the resin layer solution comprises the following components in specific parts by weight: 45 parts of formaldehyde powder, 45 parts of phenol powder and 10 parts of oxalic acid; and according to the multilayer PCB laminated cover plate, the aluminum plate and the resin are compoundedin an injection molding mode, compared with a traditional coating mode, the thickness and the size precision of the resin are high, bubbles can be completely filled through mold pressure, the hollowing phenomenon is avoided, the flatness is better, the later-period polishing and calibration procedures are reduced, the phenomena that a drill bit is likely to break and scratch a multilayer PCB areeffectively solved, the resin solution is prepared from 45 parts of formaldehyde powder, 45 parts of phenol powder and 10 parts of oxalic acid, and compared with traditional UV resin, the resin solution has the advantages of being better in high-temperature resistance, low in hygroscopicity, not prone to deformation and enough in softness, and further protects the drill bit.
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Description

technical field

[0001] The invention relates to the technical field of PCB laminated cover boards, in particular to a multilayer PCB laminated cover board, in particular to a multilayer PCB laminated cover board and a preparation method thereof. Background technique

[0002] A multi-layer PCB board is a multi-layer wiring layer. There is a dielectric layer between each two layers. There are at least three conductive layers, two of which are on the outer surface, and the remaining layer is synthesized in the insulating board. The multi-layer PCB board is in Drilling is required during processing, and in order to avoid burrs and protect laminates and drills when drilling, a cover plate is usually covered on the top surface of the multi-layer PCB, which can effectively avoid burrs and protect laminates and drills;

[0003] The existing multi-layer PCB laminated cover has certain deficiencies in processing. First of all, the traditional multi-layer PCB laminated cover is usually...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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