Multilayer PCB laminated cover plate and preparation method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 深圳市瀚鼎电路电子有限公司
- Publication Date
- 2021-03-09
Abstract
Description
technical field
[0001] The invention relates to the technical field of PCB laminated cover boards, in particular to a multilayer PCB laminated cover board, in particular to a multilayer PCB laminated cover board and a preparation method thereof. Background technique
[0002] A multi-layer PCB board is a multi-layer wiring layer. There is a dielectric layer between each two layers. There are at least three conductive layers, two of which are on the outer surface, and the remaining layer is synthesized in the insulating board. The multi-layer PCB board is in Drilling is required during processing, and in order to avoid burrs and protect laminates and drills when drilling, a cover plate is usually covered on the top surface of the multi-layer PCB, which can effectively avoid burrs and protect laminates and drills;
[0003] The existing multi-layer PCB laminated cover has certain deficiencies in processing. First of all, the traditional multi-layer PCB laminated cover is usually...