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Negative temperature coefficient thermistor chip and preparation method thereof

A thermistor chip and negative temperature coefficient technology, which is applied in the direction of resistors with negative temperature coefficient, manufacturing resistor chips, resistance manufacturing, etc., can solve the problem of unstable resistance value of thermistor at room temperature, insufficient chip thickness and density , R value and B value drift and other issues, to achieve the effect of preventing resistance drift or even failure, small resistance drift and high B value

Active Publication Date: 2021-03-12
青岛三元传感技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the extensive and in-depth application research, it is found that NTC thermistors have serious aging problems during use, and the specific performance is: as time goes by, the room temperature resistance of NTC thermistors is unstable, that is, the thermal sensitivity index (B value ) and resistance value (R value) increase with the increase of use time, when the negative temperature coefficient thermistor is applied to high temperature equipment (such as large water dispenser, large water heater), it needs to work in a high temperature environment for a long time, generally in In a high temperature environment for 1000h, the resistance deviation of this type of resistor on the market reaches about 5%, which cannot meet the needs of long-term use of high-temperature equipment, and because the chip thickness and density are not enough, the chip is prone to breakdown and failure when current is passed repeatedly
[0005] In view of the above-mentioned related technologies, the inventor believes that when the negative temperature coefficient thermistor is used in high-temperature equipment for a long time, it is prone to drift in R value and B value, and when the current is passed repeatedly, the chip is easily broken down and fails.

Method used

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  • Negative temperature coefficient thermistor chip and preparation method thereof
  • Negative temperature coefficient thermistor chip and preparation method thereof
  • Negative temperature coefficient thermistor chip and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1-5

[0051] The polyethersulfone resin in Preparation Example 1-5 is selected from Dongguan Chengyi Plastic Co., Ltd., the brand is BASF E2010 of Germany, and the nano-aluminum nitride powder is selected from Ningbo Jinlei Nano Material Technology Co., Ltd., the model is JL-AIN, and the particle size is The polyvinylpyrrolidone is 40nm, and the polyvinylpyrrolidone is selected from Shanghai Haoru Industrial Development Co., Ltd., the model is K30.

preparation example 1

[0052] Preparation Example 1: Mix 40kg of glass powder with 20kg of polyethersulfone resin, 2kg of polyvinylpyrrolidone, melt, extrude, granulate, pulverize, and pass through a 300-mesh sieve to make glass powder particles, and then mix with 20kg of silver nitrate aqueous solution, 4kg concentration is 5% formaldehyde solution and 5kg concentration is 2% sodium dodecylbenzenesulfonate solution, stir evenly, filter, wash, dry, make silver-coated glass powder, the concentration of silver nitrate aqueous solution is 0.02g / moL, the glass powder is made by the following method: 5kg SiO 2 、5.5kgBi 2 o 3 , 5kg ZnO, 2kg B 2 o 3 、4kg V 2 o 5 , 1kg Na 2 O is placed in a crucible, heated and melted at 1300°C to form a hot liquid, then 2kg of nano-aluminum nitride powder is added, stirred evenly, vacuum defoaming, the vacuum degree is 0.13MPa, and the defoaming time is 7 minutes. Quenching, ball milling, passing through a 300-mesh sieve, mixing with sodium fluoride with a concentr...

preparation example 2

[0053] Preparation Example 2: Mix 45kg of glass powder with 25kg of polyethersulfone resin, 3kg of polyvinylpyrrolidone, melt, extrude, granulate, pulverize, and pass through a 300-mesh sieve to make glass powder particles, and then mix with 25kg of silver nitrate aqueous solution, 5kg concentration is 25% formaldehyde solution and 6kg concentration is 20% sodium dodecylbenzene sulfonate solution, stir well, filter, wash, dry, make silver-coated glass powder, the concentration of silver nitrate aqueous solution is 0.04g / moL, the glass powder is made by the following method: 8kg SiO 2 、6kgBi 2 o 3 , 8kg ZnO, 2.5kg B 2 o 3 、6kg V 2 o 5 , 1.5kg Na 2 O is placed in a crucible, heated and melted at 1350°C to form a hot liquid, then 2.5kg of nano-aluminum nitride powder is added, stirred evenly, vacuum defoaming, the vacuum degree is 0.07MPa, and the defoaming time is 10 minutes. Water quenching, ball milling, passing through a 300-mesh sieve, mixing with sodium fluoride wit...

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Abstract

The invention relates to the technical field of thermistors, and particularly discloses a negative temperature coefficient thermistor chip and a preparation method thereof. The negative temperature coefficient thermistor chip is prepared from the following raw materials in parts by weight: 771.24-771.34 parts of Mn3O4; 215.82-215. 92 parts of NiO; 12.79-12.89 parts of Al2O3; the preparation methodcomprises the following steps: S1, weighing materials; s2, mixing; s3, calcining; s4, carrying out micro-crushing; s5, carrying out spray granulation; s6, tabletting and forming; s7, pre-sintering; s8, sintering; s9, polishing; s10, brushing silver. The negative temperature coefficient thermistor chip has the advantages that the consistency of the resistance value and the B value is good, the resistance drift rate is smaller than 1% after the thermistor chip is used in a high-temperature environment for a long time, the service life is long, and the stability is high; in addition, the preparation method has the advantages of being high in particle dispersion degree, not prone to agglomeration and high in chip breaking strength.

Description

technical field [0001] This application relates to the technical field of thermistors, more specifically, it relates to a negative temperature coefficient thermistor chip and a preparation method thereof. Background technique [0002] Thermistor is a sensitive element, according to the temperature coefficient is divided into positive temperature coefficient thermistor (PTC) and negative temperature coefficient thermistor (NTC), the typical characteristic of thermistor is that it is sensitive to different temperature , Different resistance values ​​are exhibited at different temperatures. The higher the temperature of the PTC thermistor, the greater the resistance value. The higher the temperature of the NTC thermistor, the lower the resistance value. They both belong to semiconductor devices. [0003] Negative temperature coefficient thermistor is a semiconductor ceramic made of two or more metal oxides such as manganese, cobalt, nickel, copper, silicon, zinc, etc., which ar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/01C04B35/622C04B35/626C04B35/64C04B41/88H01C7/04H01C17/00H01C17/28H01C17/30
CPCC04B35/016C04B35/622C04B35/6261C04B35/62655C04B35/64C04B41/88C04B41/5116H01C7/043H01C17/006H01C17/30H01C17/283C04B2235/3279C04B2235/3217C04B2235/3263C04B2235/661C04B2235/6562C04B2235/6567C04B41/5022C04B41/5062C04B41/5012C04B41/5001C04B41/50C04B41/4539C04B41/0072
Inventor 鱼灌金成慧赵振波张向营
Owner 青岛三元传感技术有限公司
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