Liquid cavity heat dissipation device based on pool boiling heat dissipation

A technology of heat dissipation device and liquid cavity, applied in the field of heat dissipation device and liquid cavity heat dissipation device, can solve the problems of complex radiator structure and insufficient heat dissipation capacity, achieve stable and efficient heat dissipation effect, improve boiling heat transfer performance, and increase liquid filling capacity Effect

Active Publication Date: 2021-03-12
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve technical defects such as complex internal structure and insufficient heat dissipation capacity of electronic device heat sinks in the prior art, the object of the present invention is to propose a liquid chamber (Liquid Chamber, LC) heat dissipa

Method used

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  • Liquid cavity heat dissipation device based on pool boiling heat dissipation
  • Liquid cavity heat dissipation device based on pool boiling heat dissipation
  • Liquid cavity heat dissipation device based on pool boiling heat dissipation

Examples

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Embodiment 1

[0040] Such as Figure 5 As shown, the external cooling device consists of cooling fins and fans. Heat dissipation fins 10 and fans 11 are installed outside the heat dissipation pipe 3 on the liquid cavity structure. The size parameters of the fan 11 and the size of the heat dissipation fins 10 are customized according to heat dissipation requirements and use environment. A plurality of through holes are opened on the heat dissipation fin 10 , and the size, quantity and arrangement of the through holes match the outer diameter, quantity and arrangement of the heat dissipation pipe 3 so that they can pass through the heat dissipation pipe 3 . The multi-layer heat dissipation fins 10 pass through the heat dissipation pipes 3 sequentially and are stacked, and are fixed and conduct heat with the heat dissipation pipes 3 by means of welding or stamping. A fan 11 is installed on both sides of the cooling fins 10 , and the two fans 11 are installed in the same direction, so as to i...

Embodiment 2

[0042] Such as Figure 6 ~ Figure 7 As shown, the difference between this embodiment and Embodiment 1 is that a cooling cavity 13 is installed outside the heat dissipation pipe 3 . One side of the cooling chamber 13 is provided with an inlet 12, and the other side is provided with an outlet 14. The cooling chamber 13 and the upper surface of the liquid chamber top plate 2 form a cooling chamber, which completely wraps the heat dissipation pipe 3, and the cooling chamber is completely filled with cooling liquid. According to different usage requirements, the cooling fluid can be water, ethylene glycol, silicone oil and other working fluids. The low-temperature coolant flows into the cooling cavity from the inlet 12, performs liquid forced convection heat exchange with the outer wall of the heat dissipation pipe 3, and flows out from the outlet 14. After being cooled by the external refrigerator, it flows in from the inlet again through the pump to realize the circulation of the...

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Abstract

A liquid cavity heat dissipation device based on pool boiling heat dissipation comprises a liquid cavity and an external heat dissipation device. The liquid cavity is composed of a liquid cavity bottom plate, a liquid cavity top plate and a heat dissipation pipe and is filled with a phase change working medium. The liquid phase change working medium absorbs heat at the bottom of the boiling area,then generates boiling heat exchange and generates steam, and the steam rises into the heat dissipation pipe through the through holes in the top plate of the liquid cavity and is condensed into liquid by means of an air-cooling or water-cooling external heat dissipation device to flow back into the liquid cavity. The compensation chamber and the liquid conveying area can effectively supply a phase change working medium to the boiling area. A pool boiling heat exchange mode is adopted, and high heat dissipation capacity is achieved. Compared with an existing vapor chamber-based radiator such as a vapor chamber, a capillary core structure is not needed, processing is convenient, internal evaporation drying can be effectively prevented while the vapor chamber-based radiator is thin, and thedevice is suitable for heat dissipation of high-power heating equipment.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic devices, and relates to a heat dissipation device, in particular to a liquid cavity heat dissipation device based on pool boiling heat dissipation. Background technique [0002] With the continuous improvement of the processing technology and process level of electronic devices, electronic chips are developing towards high integration, miniaturization and high frequency, which leads to a sharp increase in the heat generation per unit area of ​​the device, and is facing increasingly severe challenges. heat dissipation problem. If this part of the heat cannot be dissipated in time, the temperature of the device will continue to rise, which will significantly reduce the operating performance of the device, and even cause permanent damage to the device. Today, a sharp increase in temperature is a major factor in the failure of electronic devices. For highly integrated devices ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20336H05K7/20327H05K7/20309H05K7/20318H05K7/20136H05K7/20409
Inventor 魏进家周杰齐宝金刘蕾张永海
Owner XI AN JIAOTONG UNIV
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