Liquid cavity heat dissipation device based on pool boiling heat dissipation

Abstract

A liquid cavity heat dissipation device based on pool boiling heat dissipation comprises a liquid cavity and an external heat dissipation device. The liquid cavity is composed of a liquid cavity bottom plate, a liquid cavity top plate and a heat dissipation pipe and is filled with a phase change working medium. The liquid phase change working medium absorbs heat at the bottom of the boiling area,then generates boiling heat exchange and generates steam, and the steam rises into the heat dissipation pipe through the through holes in the top plate of the liquid cavity and is condensed into liquid by means of an air-cooling or water-cooling external heat dissipation device to flow back into the liquid cavity. The compensation chamber and the liquid conveying area can effectively supply a phase change working medium to the boiling area. A pool boiling heat exchange mode is adopted, and high heat dissipation capacity is achieved. Compared with an existing vapor chamber-based radiator such as a vapor chamber, a capillary core structure is not needed, processing is convenient, internal evaporation drying can be effectively prevented while the vapor chamber-based radiator is thin, and thedevice is suitable for heat dissipation of high-power heating equipment.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic devices, and relates to a heat dissipation device, in particular to a liquid cavity heat dissipation device based on pool boiling heat dissipation. Background technique [0002] With the continuous improvement of the processing technology and process level of electronic devices, electronic chips are developing towards high integration, miniaturization and high frequency, which leads to a sharp increase in the heat generation per unit area of ​​the device, and is facing increasingly severe challenges. heat dissipation problem. If this part of the heat cannot be dissipated in time, the temperature of the device will continue to rise, which will significantly reduce the operating performance of the device, and even cause permanent damage to the device. Today, a sharp increase in temperature is a major factor in the failure of electronic devices. For highly integrated devices ...

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Problems solved by technology

[0004] In order to solve technical defects such as complex internal structure and insufficient heat dissipation capacity of electronic device heat sinks in the prior art, the object of the present invention is to propose a liquid chamber (Liquid Chamber, LC) heat dissipation device heat sink based on pool boiling heat dissipation, which has The internal structure is simple, easy to process, and has a large heat dissipation capacity. The parameters of the structure can be customized according to the actual heat dissipation requirements.

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