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Copper-containing antibacterial thin-layer composite film as well as preparation method and application thereof

A composite membrane and thin-layer technology, applied in the field of separation membranes, can solve the problems of poor durability of antibacterial performance on the surface of the membrane, long post-treatment time, and increased preparation steps, etc., achieve good industrial production prospects, increase durable antibacterial ability, and simple preparation method Effect

Pending Publication Date: 2021-03-19
CHINA PETROLEUM & CHEM CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Thin-layer composite membranes used as nanofiltration membranes and reverse osmosis membranes have been widely used in various fields, but the problem of membrane fouling has always been one of the obstacles restricting its development, and it is also an important problem that needs to be solved urgently
[0004] It can be seen that the above-mentioned prior art or by immersing the reverse osmosis membrane in the solution containing antibacterial metal, or by coating a layer of antibacterial function layer on the surface of the reverse osmosis membrane, although the antibacterial performance of the membrane surface has been improved, but the On the one hand, the antibacterial metal particles attached to the surface of the film will be lost rapidly with the use of the film, resulting in poor antibacterial performance on the surface of the film; on the other hand, the preparation steps are increased, and the post-processing time is long, which increases the production cost

Method used

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  • Copper-containing antibacterial thin-layer composite film as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Add 1 g of ethylenediamine and 100 mL of deionized water to 0.812 g of copper hydroxide and stir to obtain an ethylenediamine solution of copper hydroxide, and add 100 mL of Isopar E to 0.1 g of trimesoyl chloride and stir to obtain a trimesoyl chloride solution. Contact the upper surface of the polysulfone support layer with an ethylenediamine solution containing copper hydroxide, and discharge the liquid after contacting it for 60 seconds at 25°C; then, contact the upper surface of the support layer with a trimesoyl chloride solution, and discharge it after contacting it for 30 seconds at 25°C solution; then, the film was put into an oven and heated at 70°C for 2 min to obtain the composite film CuR1. X-ray photoelectron spectroscopy test shows that the mass content of copper on the surface of the composite film is 8.2wt%. Wherein, the average thickness of the polyamide separation layer is 185 nm.

[0058] Soak the obtained composite membrane CuR1 in water for 24 hou...

Embodiment 2

[0060] Add 0.5 g of ethylenediamine and 100 mL of deionized water to 0.487 g of copper hydroxide and stir to obtain an ethylenediamine solution of copper hydroxide, and add 100 mL of Isopar E to 0.1 g of trimesoyl chloride and stir to obtain a trimesoyl chloride solution. Contact the upper surface of the polysulfone support layer with an ethylenediamine solution containing copper hydroxide, and discharge the liquid after contacting it for 30 seconds at 25°C; then, contact the upper surface of the support layer with a trimesoyl chloride solution, and discharge it after contacting it for 30 seconds at 25°C solution; then, the film was put into an oven and heated at 80°C for 3 min to obtain the composite film CuR2. X-ray photoelectron spectroscopy test shows that the mass content of copper on the surface of the composite film is 5.1wt%. Wherein, the average thickness of the polyamide separation layer is 153 nm.

[0061] Soak the obtained composite membrane CuR2 in water for 24 h...

Embodiment 3

[0063] Add 0.1 g of ethylenediamine and 100 mL of deionized water to 0.065 g of copper hydroxide and stir to obtain an ethylenediamine solution of copper hydroxide, and add 100 mL of Isopar G to 0.05 g of trimesoyl chloride and stir to obtain a trimesoyl chloride solution. Contact the upper surface of the polysulfone support layer with an ethylenediamine solution containing copper hydroxide, and discharge the liquid after contacting it for 60 seconds at 25°C; then, contact the upper surface of the support layer with a trimesoyl chloride solution, and discharge it after contacting it for 60 seconds at 25°C solution; then, the film was put into an oven and heated at 90°C for 5 min to obtain a composite film CuR3. X-ray photoelectron spectroscopy test shows that the mass content of copper on the surface of the composite film is 1.8wt%. Wherein, the average thickness of the polyamide separation layer is 139 nm.

[0064] Soak the obtained composite membrane CuR3 in water for 24 ho...

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Abstract

The invention discloses a copper-containing antibacterial thin-layer composite film as well as a preparation method and application thereof. The composite film comprises an enhancement layer, a supporting layer and a separation layer, wherein the separation layer is located on one surface of the supporting layer, the enhancement layer is located on the other surface of the supporting layer, the supporting layer is a polymer porous membrane, the separation layer is a polyamide separation layer loaded with copper hydroxide, and the mass content of elemental copper in the separation layer is 0.5-10 wt%. The preparation method comprises the following steps: firstly, preparing a polyamine solution and a polyacyl chloride solution of copper hydroxide; and sequentially contacting the supporting layer with the polyamine solution and the polyacyl chloride solution of copper hydroxide, and carrying out heat treatment. The copper-containing antibacterial thin-layer composite film prepared according to the invention has the advantages of lasting antibacterial performance, simple preparation process, suitability for mass production and the like.

Description

technical field [0001] The invention relates to the field of separation membranes, in particular to a copper-containing antibacterial thin-layer composite membrane and its preparation method and application. Background technique [0002] Thin-layer composite membranes used as nanofiltration membranes and reverse osmosis membranes have been widely used in various fields, but the problem of membrane fouling has always been one of the obstacles restricting its development, and it is also an important problem that needs to be solved urgently. Especially during use, microorganisms are easy to grow, multiply and migrate on the surface of the membrane to cause biological pollution, which directly affects the performance of the membrane, reduces the quality and quantity of produced water, reduces the effective operating pressure, and increases operating costs. [0003] Studies have shown that introducing antibacterial agents on the surface of the membrane to endow the membrane with ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01D69/12B01D69/10B01D69/02B01D67/00
CPCB01D69/12B01D69/10B01D69/02B01D67/0079B01D2325/48
Inventor 于浩刘轶群潘国元张杨
Owner CHINA PETROLEUM & CHEM CORP
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