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Preparation method and production line of graphene heat conduction film

A graphene film and graphene technology, applied in the direction of graphene, chemical instruments and methods, inorganic chemistry, etc., can solve problems such as difficult mass production, structural integrity needs to be improved, and complex structure, so as to expand types and ensure industrial The effect of production safety and high degree of automation

Active Publication Date: 2021-03-19
GUANGDONG UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese patent CN110256981A discloses the preparation and structure of a graphene heat-conducting film. Its structure is relatively complicated, and the structural integrity needs to be improved, and it is not easy to mass produce.

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  • Preparation method and production line of graphene heat conduction film
  • Preparation method and production line of graphene heat conduction film
  • Preparation method and production line of graphene heat conduction film

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Embodiment Construction

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0032] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "left", " The orientation or positional relationship indicated by "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" is Based on the orientation or positional relationship shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, and does not indica...

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Abstract

The invention discloses a preparation method and a production line of a graphene heat conduction film, and relates to the field of heat conduction device preparation. The preparation method of the graphene heat conduction film comprises the following steps: S1, uniformly stirring and mixing a carbon source and a heat conduction enhancer; S2, carrying out electrical discharge machining on the mixedcarbon source and heat conduction enhancer to obtain doped graphene sheets; S3, screening the doped graphene sheets to obtain graphene coarse sheets; S4, cleaning and drying the graphene coarse sheets; S5, blending the cleaned and dried graphene coarse sheets with an N-methyl pyrrolidone solution to obtain carbon thick slurry; S6, carrying out blade coating on the carbon thick slurry to form a graphene film; and S7, carrying out discharge hot-pressing treatment on the graphene film to obtain the graphene heat conduction film. A wide carbon source is processed to prepare the heat conduction film, so that a solution is provided for solving the heat dissipation problem of next-generation electronic devices, and the industrial requirements of easiness in operation, high efficiency and low cost are met.

Description

technical field [0001] The invention relates to the field of preparation of heat conduction devices, in particular to a preparation method and production line of a graphene heat conduction film. Background technique [0002] With the increasing functionalization and miniaturization of electronic components, a large number of heat generation problems, the accumulation of heat will have a serious impact on the life of electronic equipment, especially with the arrival of the 5G era, the heat dissipation management in communication Performance puts forward higher requirements. Traditional thermal management materials are mainly copper-based, aluminum-based and silver-based metal materials, which have the advantages of good thermal conductivity and easy processing. However, due to the high density value of metal materials, in some applications requiring small weight In some occasions, non-metallic heat-conducting materials are more suitable. In recent years, non-metallic therma...

Claims

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Application Information

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IPC IPC(8): C01B32/194C01B32/184
CPCC01B32/184C01B32/194
Inventor 陈云丁树权高增光肖嘉薇吴然皓陈新陈桪高健
Owner GUANGDONG UNIV OF TECH
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