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Manufacturing method of conductive circuit board

A manufacturing method and circuit board technology, which is applied in the fields of printed circuit manufacturing, laminated printed circuit board, printed circuit, etc., can solve problems such as difficulties, and achieve the effect of simple and efficient process

Inactive Publication Date: 2021-03-19
SHENZHEN BAROY NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, even if the metal film can be formed thicker, it is difficult to remove unnecessary parts from the thick metal film by, for example, laser irradiation.

Method used

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  • Manufacturing method of conductive circuit board
  • Manufacturing method of conductive circuit board
  • Manufacturing method of conductive circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] S1. Cover a layer of epoxy resin organic film layer by printing on the surface of the ceramic substrate, and the thickness of the film layer is 80 μm;

[0063] S2. Applying a layer of polycarbonate peelable adhesive layer on the surface of the organic film layer by printing, with a thickness of 8 μm;

[0064] S3. Form a preset circuit pattern on the organic film layer and the peelable adhesive layer by laser engraving;

[0065] S4. Scratch-coat conductive paste on the surface of the peelable adhesive layer and the groove of the circuit pattern to fully fill the groove of the circuit pattern. The components of the conductive paste are copper powder 65%, bismuth-containing glass frit 3 %, acrylate resin 12%, butyl carbitol acetate 10%, dispersant 10%;

[0066] S5. Peel off the peelable adhesive layer by manual method, and take away excess conductive paste on the surface;

[0067] S6. Heat-treat the substrate with the conductive paste and the organic film layer attached ...

Embodiment 2

[0069] S1. Cover the surface of the ceramic substrate with a UV-cured acrylate resin organic film layer by printing, and the thickness of the film layer is 15 μm;

[0070] S2. Applying a peelable adhesive layer of thermoplastic acrylic resin on the surface of the organic film layer by printing, with a thickness of 2.5 μm;

[0071] S3. Form a preset circuit pattern on the organic film layer and the peelable adhesive layer by laser engraving;

[0072] S4. Scratch-coat conductive paste on the surface of the peelable adhesive layer and the groove of the circuit pattern to fully fill the groove of the circuit pattern. The components of the conductive paste are copper powder 65%, bismuth-containing glass frit 3 %, acrylate resin 12%, butyl carbitol acetate 10%, dispersant 10%;

[0073] S4 additional step, pre-baking the conductive circuit substrate filled with the conductive paste obtained in the previous steps at 150° C. for 10 minutes;

[0074] S5. Peel off the peelable adhesive...

Embodiment 3

[0077] S1. Cover a thermally cured epoxy resin organic film layer on the surface of the ceramic substrate by thermocompression bonding, and the thickness of the film layer is 25 μm;

[0078] S2. Applying a peelable adhesive layer of polyethylene terephthalate on the surface of the organic film layer by printing, with a thickness of 4 μm;

[0079] S3. Form a preset circuit pattern on the organic film layer and the peelable adhesive layer by laser engraving;

[0080] S4. Scratch-coat conductive paste on the surface of the strippable adhesive layer and the groove of the circuit pattern to fully fill the groove of the circuit pattern. The components of the conductive paste are 60% of silver powder and 5% of lead-containing glass frit , N-4 ethyl cellulose 10%, butyl carbitol 15%, dispersant 10%;

[0081] S4 additional step, pre-baking the conductive circuit substrate filled with the conductive paste obtained in the previous steps at 120° C. for 30 minutes;

[0082] S5. Peel off ...

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Abstract

The invention discloses a manufacturing method of a conductive circuit board. The surface of a glass or ceramic substrate is covered with an organic adhesive film and a strippable layer, a precise circuit pattern is etched, a pattern groove is filled with a high-temperature sintering type conductive material, the strippable layer is stripped, finally, the organic adhesive film is burnt out throughhigh-temperature sintering treatment, and meanwhile, a conductive material is densified to form a precise conductive circuit. According to the method, a circuit with the resolution of 20 microns or even more can be manufactured on the surface of the glass or ceramic substrate, and a three-dimensional or thicker circuit can be manufactured through multiple times of superposition.

Description

technical field [0001] The invention relates to the technical field of conductive patterns, and more specifically relates to a method for manufacturing a conductive circuit board. Background technique [0002] At present, inorganic materials are mostly used as conductive circuit substrates by sputtering, vapor deposition, thermal pressing metal foil and other methods. The first two methods are mainly used for the electroplating seed layer of semi-additive circuit boards, and the equipment is expensive, especially for large substrates. Streamlined operations cannot be achieved. The latter method directly produces a thick copper substrate, and uses an etching process to produce circuits, which has slightly poor circuit accuracy and low material utilization. [0003] In addition, in the field of FPD with high functional development, further high-definition requirements are put forward for the conductive pattern in the conductive pattern forming substrate. Conductive patterns ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/02H05K3/04H05K3/10H05K3/20
CPCH05K3/0058H05K3/025H05K3/048H05K3/10H05K3/20
Inventor 郭冉
Owner SHENZHEN BAROY NEW MATERIAL TECH CO LTD