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Intensified boiling structure and preparation method and application thereof

A technology to enhance boiling and concave-convex structure, applied in electrical components, electric solid devices, circuits, etc., can solve the problems of low heat flux density and electronic chip heat dissipation effect that cannot meet actual needs, and achieve the goal of increasing critical heat flux density and improving heat dissipation effect Effect

Pending Publication Date: 2021-03-30
SUGON DATAENERGYBEIJING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the electronic chip is directly in contact with the refrigerant to make the heat flux of the refrigerant phase change vaporization solution low, resulting in the heat dissipation effect of the electronic chip cannot meet the actual needs

Method used

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  • Intensified boiling structure and preparation method and application thereof
  • Intensified boiling structure and preparation method and application thereof
  • Intensified boiling structure and preparation method and application thereof

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preparation example Construction

[0037] The embodiment of the present invention also provides a preparation method of the above-mentioned enhanced boiling structure. The preparation method includes: printing heat dissipation ribs 102 on the heat conduction substrate 101 by using 3D printing additive method, and simultaneously forming heat dissipation ribs 102 on the heat conduction substrate 101 and heat dissipation ribs 102 Micro-nano concave-convex structure 103. Among them, the 3D printing material can be metal powder.

[0038]Optionally, the above-mentioned 3D printing additive methods can be selected laser sintering (SLS, Selected LaserSintering), selective laser melting (SLM, Selective laser melting), laser metal powder deposition (LMD, Laser Metal Deposition) and electron beam melting (EBM , Electron Beam Melting) in one or more combination.

[0039] Further, the above-mentioned 3D printing additive method adopts selective laser sintering: the metal powder is mixed with paraffin, the mixing mass ratio...

Embodiment approach 1

[0046] In this embodiment, the material of the thermally conductive substrate 101 is copper, the thickness of the thermally conductive substrate 101 is 1 mm, the printing material is copper spherical powder material (copper powder), and the D50 particle size of the copper spherical powder material is 10 μm. The setting program is that the cooling ribs 102 adopt square column ribs, the length of the square column ribs is 200 μm, the width of the square column ribs is 200 μm, the distance between the centers of the square column ribs is 200 μm, and the height of the square column ribs is 1000 μm.

[0047] The 3D printing additive method adopts selective laser sintering, in which the mixed mass ratio of copper powder and paraffin wax is 100:9, the printing temperature is 300°C, and the thickness of each printing layer is 100 μm, and 10 printings are performed. After the first product is completed, the printed structure and the heat-conducting substrate 101 are put into a sintering...

Embodiment approach 2

[0049] In this embodiment, the material of the thermally conductive substrate 101 is copper, the thickness of the thermally conductive substrate 101 is 1mm, the printing material is copper spherical powder material, and the D50 particle size of the copper spherical powder material is 10 μm. The setting program is that the cooling ribs 102 adopt square column ribs, the length of the square column ribs is 100 μm, the width of the square column ribs is 100 μm, the distance between the centers of the square column ribs is 100 μm, and the height of the square column ribs is 2000 μm.

[0050] The 3D printing additive method adopts selective laser sintering, in which the mixed mass ratio of copper powder and paraffin wax is 100:9, the printing temperature is 300°C, and the thickness of each printing layer is 100 μm, and 10 printings are performed. After the first product is completed, the printed structure and the heat-conducting substrate 101 are put into a sintering furnace at a sin...

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Abstract

The invention provides an intensified boiling structure and a preparation method and application thereof, and relates to the technical field of heat dissipation. The intensified boiling structure comprises a heat conduction substrate, heat dissipation ribs and micro-nano concave-convex structures. The heat dissipation ribs are located on the first surface of the heat conduction substrate, and themicro-nano concave-convex structures are formed on the first surface and the surfaces of the heat dissipation ribs; and the sizes of the radiating ribs are micron-sized to millimeter-sized. Accordingto the intensified boiling structure, through the heat dissipation ribs and the micro-nano concave-convex structure, the nuclear boiling heat exchange performance and the critical heat flux density ofthe electronic chip are improved, and therefore the heat dissipation effect of the electronic chip is improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to an enhanced boiling structure and its preparation method and application. Background technique [0002] With the rapid advancement of 5G, artificial intelligence, and big data, the requirements for data and graphics processing efficiency are getting higher and higher, and the chip is the core component. The faster the data calculation speed, the greater the power of the chip and the more heat it generates. , the heat dissipation problem faced will become more and more severe. At present, the heat flux density of supercomputer GPU (Graphics Processing Unit, display chip) has reached 100W / cm 2 , the traditional heat dissipation method has been unable to solve such a high heat flux density. [0003] Most common computers rely on cold air (air cooling) to cool the machine. Compared with air cooling, liquid cooling (or water cooling) has two major advantages: one is that it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/467H01L23/473H01L23/427
CPCH01L23/3672H01L23/427H01L23/467H01L23/473
Inventor 张鹏默蓬勃伊波力郭双江
Owner SUGON DATAENERGYBEIJING CO LTD
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