PCB milling cutter with automatic chip removal capability
A technology for automatically arranging and milling cutters, which is applied in the direction of milling cutters, manufacturing tools, milling machine equipment, etc., can solve the problems of insufficient durability of PCB milling cutters, and achieve the effects of avoiding oxidation, saving resources and improving durability
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Embodiment 1
[0033] Such as Figure 1-5 As shown, the PCB milling cutter with automatic chip removal capability of the present invention includes a handle 1 and a blade 4 fixedly connected to the handle 1. The lower part of the handle 1 forms a connecting portion with an outer diameter equal to the blade 4. On the connecting portion An installation groove is provided, and the magnetic strip 2 is fixedly installed in the installation groove, and the blade portion 4 is fixedly connected with the connection portion through the welding portion 3. The outer diameter of the welding portion 3 is equal to the outer diameter of the blade portion 4, and the blade portion 4 is also installed on the row chip device. The chip removal device includes a sleeve, a magnetic strip 2 and a fan blade 9 installed on the outer surface of the lower part of the sleeve. The sleeve is sleeved on the outer surface of the blade 4, and the length of the sleeve is greater than the length of the blade 4 and less than th...
Embodiment 2
[0041] The difference from Embodiment 1 is that the blade portion 4 of the PCB milling cutter of the present invention includes a substrate 41 and a bottom layer 42 deposited on the surface of the substrate 41, an anti-oxidation layer 43 and a wear-resistant layer 44, and the bottom layer 42, the anti-oxidation layer 43 and the anti-oxidation layer The grinding layer 44 is attached to the surface of the milling cutter base 41 from the inside to the outside in sequence, the bottom layer 42 is niobium; the anti-oxidation layer 43 contains niobium, silicon, chromium, titanium, zinc and samarium; the wear-resistant layer 44 is silicon nitride / nitride Titanium aluminum niobium.
[0042] The preparation method of the cutting edge comprises the following steps: degreasing the substrate using the method of the prior art, cleaning with an organic solvent, rinsing and drying with deionized water; -3 Below Pa, at a temperature of 340°C, perform gas plasma cleaning on the substrate. The s...
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