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Preparation method of composite concave angle micron structure with super-amphiphobic property

A micron-structured, super-amphiphobic technology, which is applied in the field of preparation of composite concave-corner micro-structures, can solve the problems of inconspicuous nano-structured concave-corner structure features, poor wear resistance of nano-scale structures, and affecting application potential, and achieve excellent super-amphiphobic performance, good wear resistance, simple preparation process

Pending Publication Date: 2021-04-09
NANJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the patent CN108466015A obtains a super-amphiphobic surface with excellent performance by preparing a micro-nano composite reentrant structure, but the reentrant structure characteristics of the nanostructure are not obvious, and the wear resistance of the nanoscale structure is poor, which affects its practical application potential

Method used

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  • Preparation method of composite concave angle micron structure with super-amphiphobic property
  • Preparation method of composite concave angle micron structure with super-amphiphobic property
  • Preparation method of composite concave angle micron structure with super-amphiphobic property

Examples

Experimental program
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Effect test

Embodiment 1

[0035] The photolithographic mask pattern is selected as a non-parallel square array with a side length of 50 microns and a pitch of 50 microns. The specific implementation process is as follows:

[0036] Glass is selected as the substrate material, and a silicon layer with a thickness of 5 microns is deposited on the surface by physical vapor phase.

[0037] Preparation of photoresist layer: spin-coat photoresist AZ5214 on the silicon surface, spin-coating speed is 4000 rpm, spin-coating time is 40s, photoresist thickness is 1 micron, and the photoresist is baked at 90°C for 1min. pre-curing;

[0038] Photolithography exposure: the light intensity is 23mj / cm 2 UV light exposure for 5s;

[0039] Developing: place in developer solution AZ 300MIF, developing time is 20s, the exposed photoresist is dissolved to form a microcolumn array of photoresist;

[0040] Deep silicon etching: use the photoresist micropillar array as an etching mask, use deep silicon etching technology to...

Embodiment 2

[0043] The photolithographic mask pattern is selected as a square array with a side length of 50 microns and a pitch of 50 microns arranged in parallel. The specific implementation process is as follows:

[0044] Metal nickel is selected as the substrate material, and a 3 micron thick silicon layer is deposited on the surface of the nickel sheet by physical vapor phase;

[0045] Preparation of photoresist layer: Spin-coat photoresist S1813 on the silicon surface, spin-coating speed is 3000 rpm, spin-coating time is 40s, photoresist thickness is 1.5 microns, bake 1.5min at 110°C for photoresist carry out pre-curing;

[0046] Photolithography exposure: the light intensity is 38mj / cm 2 UV light exposure for 2.5s;

[0047]Developing: Place in developer solution AZ300MIF, developing time is 40s, the exposed photoresist is dissolved to form a microcolumn array of photoresist;

[0048] Deep silicon etching: use the photoresist micropillar array as an etching mask, use deep silicon...

Embodiment 3

[0051] The photolithographic mask pattern is selected as a square array with a side length of 50 microns and a pitch of 25 microns in parallel. The specific implementation process is as follows:

[0052] Select glass as the substrate material, and use physical vapor deposition on the surface of the nickel sheet to deposit a silicon layer with a thickness of 4 microns;

[0053] Preparation of photoresist layer: Spin-coat photoresist AZ5214 on the silicon surface, spin-coating speed is 6000 rpm, spin-coating time is 60s, photoresist thickness is 0.8 microns, and the photoresist is baked at 120°C for 1min. pre-curing;

[0054] Photolithography exposure: the light intensity is 45mj / cm 2 Exposure to UV light for 2s;

[0055] Developing: Place in developer solution AZ300MIF, developing time is 45s, the exposed photoresist is dissolved to form a microcolumn array of photoresist;

[0056] Deep silicon etching: using the photoresist micropillar array as an etching mask, using deep s...

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Abstract

The invention relates to a preparation method of composite concave angle micron structure with the super-amphiphobic property, and the method comprises the following specific steps: evaporating a silicon layer on the surface of a substrate, spin-coating photoresist on the surface, curing, transferring a mask plate pattern to the photoresist by using a photoetching process, performing developing, and taking the patterned photoresist as an etching mask; transferring the photoresist micron structure to a silicon substrate by utilizing a deep silicon etching process, obtaining a T-shaped multilayer groove micron composite structure by utilizing the characteristics of the deep silicon etching process and the selective transverse etching of the photoresist and silicon, and modifying 1H, 1H, 2H, 2H-perfluorodecyltrichlorosilane monomolecular layers on the surface to realize stable super-hydrophobic and super-oleophobic properties. The prepared pure micron composite concave angle structure has excellent super-amphiphobic performance and good abrasion resistance, the preparation method is simple and suitable for batch production, the pure micron composite concave angle structure can be applied to self-cleaning surfaces in the fields of industrial production, daily life and the like, and the application prospect is good.

Description

technical field [0001] The invention belongs to the field of micro-nano processing, and in particular relates to a method for preparing a composite concave-angle microstructure with superamphiphobic properties. Background technique [0002] Due to its special surface wetting properties, superamphiphobic surfaces have great application prospects in anti-icing, water-oil separation, biomedical devices, and self-cleaning surfaces. Liquids with low surface energy are more prone to surface wetting than water with a higher surface energy. Therefore, the realization of superoleophobic properties is the main difficulty in obtaining superamphiphobic surfaces. [0003] According to the existing research, the specific micro-nano concave angle structure is constructed on the surface, and the upward Laplace force is used to stabilize the droplet in the Cassie state with an air layer, so that the low surface energy liquid can also be non-wetting on its surface, which is obtained. An imp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
CPCB81C1/00531B81C1/00388B81C1/00206
Inventor 李旸陆春华倪亚茹
Owner NANJING UNIV OF TECH