Method for forming high-strength, high-toughness and high-corrosion-resistance copper-based alloy through selective laser melting
A technology of laser selective melting and copper-based alloys, which is applied in the direction of improving energy efficiency, process efficiency, metal material coating technology, etc., to achieve the effect of high electrochemical corrosion resistance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment ( 1
[0015] The carbon steel plate that has been derusted and sandblasted is used as the base material, and the high-strength, high-toughness and high-corrosion-resistant copper-based alloy is prepared by laser selective melting and forming. The microstructural characteristics of the obtained bulk nano-twinned copper-based composite material are as follows: As a matrix, nano-twins with a sheet thickness of 5-10 nm are distributed in ε-Cu with high-angle grain boundaries and face-centered cubic structure; nano-sized γ-Cu with face-centered cubic structure formed due to liquid phase separation There are a large number of nano-twins distributed in Fe particles; these γ-Fe particles are evenly distributed in ε-Cu; supersaturated Fe and Ni are in solid solution in ε-Cu; a large amount of Cr, Ni and Supersaturated Cu; 80% IACS of the copper-based alloy, room temperature tensile breaking strength up to 0.6GPa, elongation up to 30%; in 3.5 wt.% NaCl solution, 0.5M hydrochloric acid or sulfu...
Embodiment ( 2
[0021] The carbon steel plate that has been derusted and sandblasted is used as the base material, and the high-strength, high-toughness and high-corrosion-resistant copper-based alloy is prepared by laser selective melting and forming. The microstructural characteristics of the obtained bulk nano-twinned copper-based composite material are as follows: As a matrix, nano-twins with a sheet thickness of 5-10 nm are distributed in ε-Cu with high-angle grain boundaries and face-centered cubic structure; nano-sized γ-Cu with face-centered cubic structure formed due to liquid phase separation There are a large number of nano-twins distributed in Fe particles; these γ-Fe particles are evenly distributed in ε-Cu; supersaturated Fe and Ni are in solid solution in ε-Cu; a large amount of Cr, Ni and Supersaturated Cu; 70% IACS of the copper-based alloy, room temperature tensile breaking strength up to 0.9GPa, elongation up to 20%; in 3.5 wt.% NaCl solution, 0.5M hydrochloric acid or sulfu...
Embodiment ( 3
[0027]The carbon steel plate that has been derusted and sandblasted is used as the base material, and the high-strength, high-toughness and high-corrosion-resistant copper-based alloy is prepared by laser selective melting and forming. The microstructural characteristics of the obtained bulk nano-twinned copper-based composite material are as follows: As a matrix, nano-twins with a sheet thickness of 5-10 nm are distributed in ε-Cu with high-angle grain boundaries and face-centered cubic structure; nano-sized γ-Cu with face-centered cubic structure formed due to liquid phase separation There are a large number of nano-twins distributed in Fe particles; these γ-Fe particles are evenly distributed in ε-Cu; supersaturated Fe and Ni are in solid solution in ε-Cu; a large amount of Cr, Ni and Supersaturated Cu; 60% IACS of the copper-based alloy, room temperature tensile breaking strength up to 1.3GPa, elongation up to 10%; in 3.5 wt.% NaCl solution, 0.5M hydrochloric acid or sulfur...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
tensile strength at break | aaaaa | aaaaa |
tensile strength at break | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com