Method for forming high-strength, high-toughness and high-corrosion-resistance copper-based alloy through selective laser melting

A technology of laser selective melting and copper-based alloys, which is applied in the direction of improving energy efficiency, process efficiency, metal material coating technology, etc., to achieve the effect of high electrochemical corrosion resistance

Active Publication Date: 2021-04-13
JINAN UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, using laser selective melting forming technology, it only takes one step to prepare nano-twins and in-situ nanoparticles in copper and copper alloys, which can synergistically enhance the strength, toughness and corrosion resistance of copper and copper alloys, and achieve high Performance The integrated design and manufacture of copper and copper alloy structure and performance has not been reported in the literature

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment ( 1

[0015] The carbon steel plate that has been derusted and sandblasted is used as the base material, and the high-strength, high-toughness and high-corrosion-resistant copper-based alloy is prepared by laser selective melting and forming. The microstructural characteristics of the obtained bulk nano-twinned copper-based composite material are as follows: As a matrix, nano-twins with a sheet thickness of 5-10 nm are distributed in ε-Cu with high-angle grain boundaries and face-centered cubic structure; nano-sized γ-Cu with face-centered cubic structure formed due to liquid phase separation There are a large number of nano-twins distributed in Fe particles; these γ-Fe particles are evenly distributed in ε-Cu; supersaturated Fe and Ni are in solid solution in ε-Cu; a large amount of Cr, Ni and Supersaturated Cu; 80% IACS of the copper-based alloy, room temperature tensile breaking strength up to 0.6GPa, elongation up to 30%; in 3.5 wt.% NaCl solution, 0.5M hydrochloric acid or sulfu...

Embodiment ( 2

[0021] The carbon steel plate that has been derusted and sandblasted is used as the base material, and the high-strength, high-toughness and high-corrosion-resistant copper-based alloy is prepared by laser selective melting and forming. The microstructural characteristics of the obtained bulk nano-twinned copper-based composite material are as follows: As a matrix, nano-twins with a sheet thickness of 5-10 nm are distributed in ε-Cu with high-angle grain boundaries and face-centered cubic structure; nano-sized γ-Cu with face-centered cubic structure formed due to liquid phase separation There are a large number of nano-twins distributed in Fe particles; these γ-Fe particles are evenly distributed in ε-Cu; supersaturated Fe and Ni are in solid solution in ε-Cu; a large amount of Cr, Ni and Supersaturated Cu; 70% IACS of the copper-based alloy, room temperature tensile breaking strength up to 0.9GPa, elongation up to 20%; in 3.5 wt.% NaCl solution, 0.5M hydrochloric acid or sulfu...

Embodiment ( 3

[0027]The carbon steel plate that has been derusted and sandblasted is used as the base material, and the high-strength, high-toughness and high-corrosion-resistant copper-based alloy is prepared by laser selective melting and forming. The microstructural characteristics of the obtained bulk nano-twinned copper-based composite material are as follows: As a matrix, nano-twins with a sheet thickness of 5-10 nm are distributed in ε-Cu with high-angle grain boundaries and face-centered cubic structure; nano-sized γ-Cu with face-centered cubic structure formed due to liquid phase separation There are a large number of nano-twins distributed in Fe particles; these γ-Fe particles are evenly distributed in ε-Cu; supersaturated Fe and Ni are in solid solution in ε-Cu; a large amount of Cr, Ni and Supersaturated Cu; 60% IACS of the copper-based alloy, room temperature tensile breaking strength up to 1.3GPa, elongation up to 10%; in 3.5 wt.% NaCl solution, 0.5M hydrochloric acid or sulfur...

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Abstract

The invention relates to a method for forming a high-strength high-toughness high-corrosion-resistance copper-based alloy by selective laser melting. The method is characterized by comprising the following steps: (1) slicing a copper-based alloy part CAD (Computer-Aided Design) model layer by layer, and generating a series of selective laser areas to melt and form a two-dimensional scanning track according to slice contour information; and (2) stacking the special copper-based alloy powder point by point, line by line and layer by layer to form a three-dimensional solid copper-based alloy by adopting a selective laser melting method according to the generated scanning track. The copper-based alloy prepared by adopting the selective laser melting method has a biphasic heterogeneous microstructure, so that structural performance integrated design and manufacturing of the high-strength high-toughness high-corrosion-resistance copper-based alloy can be realized in one step; and the problems that a conventional method such as multi-pass rolling after fusion casting is complex in process, multi-step forming exists, and personalized and flexible manufacturing cannot be met are solved.

Description

technical field [0001] The invention relates to a method for forming a high-strength, toughness and high-corrosion-resistant copper-based alloy by laser selective melting, and belongs to the technical field of laser additive manufacturing (3D printing). Background technique [0002] Copper and copper alloys have excellent electrical conductivity, thermal conductivity, plasticity and toughness, and are widely used in the fields of electronic devices, metallurgical equipment, aviation and national defense. However, the low strength and poor wear resistance of copper and copper alloys greatly reduce their service life, thereby greatly limiting their application range. At present, electroplating and plasma spraying methods are usually used to improve the surface properties of copper and copper alloys. Among them, the thickness of the electroplating layer is very thin, and it is chemically combined with the substrate with poor bonding force; the plasma sprayed layer has a high p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/10C22C9/00
CPCC23C24/106C22C9/00Y02P10/25
Inventor 周圣丰王小健杨俊杰易艳良张治国李卫
Owner JINAN UNIVERSITY
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