Preparation method of high-thermal-conductivity graphite aerogel-based composite thermal interface material

A technology of high thermal conductivity graphite and thermal interface material, which is applied in the direction of modification, cooling/ventilation/heating transformation through conduction and heat transfer, etc., which can solve the problems of large elastic modulus, low elastic modulus, and reduction of contact thermal resistance.

Active Publication Date: 2021-04-27
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Vertically aligned graphene can be obtained by using the above physical methods, but its elastic modulus is very large. An ideal thermal interface material needs to have the characteristics of low elastic modulus so that it can fully contact with heatin...

Method used

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  • Preparation method of high-thermal-conductivity graphite aerogel-based composite thermal interface material
  • Preparation method of high-thermal-conductivity graphite aerogel-based composite thermal interface material
  • Preparation method of high-thermal-conductivity graphite aerogel-based composite thermal interface material

Examples

Experimental program
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Effect test

Embodiment 1

[0032] In this embodiment, the injection molding method is used to prepare graphene airgel / polymer composite flexible heat-conducting film, and its preparation method is as follows:

[0033] (1) Weigh 0.516 g of ascorbic acid, and add 13.5 mL of deionized water into a beaker.

[0034] (2) Place the beaker containing the ascorbic acid solution on a magnetic stirrer, and at the same time, add 1.5 ml of GO aqueous solution with a concentration of 10 mg / mL to the centrifuge tube with a pipette gun. The stirring time was 10 min to ensure that the GO aqueous solution and the ascorbic acid solution were mixed evenly.

[0035] (3) Transfer the uniformly mixed salt solution in step (2) to the reaction kettle, and place the reaction kettle in a blast drying oven at 120° C. for 12 hours.

[0036] (4) Transfer the reaction product obtained in step (3) to a centrifuge tube, rinse with deionized water and ethanol three times respectively.

[0037] (5) Place the sample cleaned in step (4) ...

Embodiment 2

[0044] In this embodiment, the injection molding method is used to prepare graphene airgel / polymer composite flexible heat-conducting film, and its preparation method is as follows:

[0045] (1) Weigh 0.516 g of ascorbic acid, and add 11.5 mL of deionized water into a beaker.

[0046] (2) Place the beaker containing the ascorbic acid solution on a magnetic stirrer, and at the same time, add 4.5 ml of GO aqueous solution with a concentration of 10 mg / mL to the centrifuge tube with a pipette gun. The stirring time was 60min to ensure that the GO aqueous solution and the ascorbic acid solution were mixed evenly.

[0047] (3) Transfer the uniformly mixed salt solution in step (2) to the reaction kettle, and place the reaction kettle in a blast drying oven at 180° C. for 2 hours.

[0048] (4) Transfer the reaction product obtained in step (3) to a centrifuge tube, rinse with deionized water and ethanol three times respectively.

[0049] (5) Place the sample cleaned in step (4) an...

Embodiment 3

[0056] In this embodiment, the injection molding method is used to prepare graphene airgel / polymer composite flexible heat-conducting film, and its preparation method is as follows:

[0057] (1) Weigh 0.516 g of ascorbic acid, and add 7.5 mL of deionized water into a beaker.

[0058] (2) Place the beaker containing the ascorbic acid solution on a magnetic stirrer, and at the same time, add 7.5 ml of GO aqueous solution with a concentration of 10 mg / mL to the centrifuge tube with a pipette gun. The stirring time was 120min to ensure that the GO aqueous solution and the ascorbic acid solution were mixed evenly.

[0059] (3) Transfer the uniformly mixed salt solution in step (2) to the reaction kettle, and place the reaction kettle in a blast drying oven at 180° C. for 2 hours.

[0060] (4) Transfer the reaction product obtained in step (3) to a centrifuge tube, rinse with deionized water and ethanol three times respectively.

[0061] (5) Place the sample cleaned in step (4) an...

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Abstract

The invention discloses a preparation method of a high-thermal-conductivity graphite aerogel-based composite thermal interface material, and relates to a thermal interface material. The preparation method comprises the following steps of: adding ascorbic acid into deionized water, and stirring to obtain a uniform ascorbic acid solution; stirring, adding a GO aqueous solution, transferring the obtained mixed solution into a reaction kettle lining, sealing the reaction kettle lining, putting the reaction kettle lining into a stainless steel shell, and reacting in a blast drying oven; transferring a reaction product from the reaction kettle lining into other containers, and repeatedly cleaning the reaction product with deionized water and ethanol; freezing a cleaned sample, and then transferring the frozen sample into a freeze dryer for drying; putting the sample into a mold, compressing the sample by using a certain pressure, and then pouring a prepared polymer solution into the mold; drying the sample in a vacuum drying oven; and demolding the dried sample from the mold to obtain the high-thermal-conductivity graphite aerogel-based composite thermal interface material. The composite thermal interface material is high in longitudinal heat conductivity, good in mechanical property, capable of achieving self-supporting and easy to store, and the bottleneck problem of heat dissipation of electronic products is expected to be solved.

Description

technical field [0001] The invention relates to a thermal interface material, in particular to a preparation method of a graphite airgel-based composite thermal interface material with high thermal conductivity. Background technique [0002] High temperatures will have a detrimental effect on the stability, reliability and life of electronic components. Ensuring that the heat generated by heating electronic components can be discharged in a timely manner has become an important aspect of the system assembly of microelectronics products. For portable electronic products with high integration and assembly density, heat dissipation has even become the technology of the entire product. Bottleneck problem. In recent years, in the field of microelectronics, a new discipline - Thermal Management (Thermal Management) has been gradually developed, which specializes in the safe heat dissipation methods, heat dissipation equipment and materials used in various electronic equipment; am...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L83/04C08L63/00C08K7/24H05K7/20
CPCC08J5/18H05K7/2039C08J2383/04C08J2363/00C08K7/24
Inventor 张学骜郭晓晓张宇锋程书建蔡加法
Owner XIAMEN UNIV
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