SiCNO-based piezoresistive thin film system and preparation method thereof
A technology of film and base pressure, applied in the field of SiCNO-based piezoresistive film system and its preparation, can solve problems such as unreported, and achieve the effects of good adhesion, controllable composition, and low temperature of composition
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[0022] Embodiment: A SiCNO-based piezoresistive film system, including a stainless steel substrate 1, on which a silicon nitride film layer 2, a SiBCN film layer 3, and a Co-doped SiCNO film layer 4 are sequentially arranged, and a Co-doped SiCNO film layer 4 is provided with an electrode 6 via a SiAlCN thin film layer 5 .
[0023] The silicon nitride film layer has a thickness of 1-5 microns, preferably 2 microns, as an insulating layer.
[0024] The SiBCN thin film layer has a thickness of 500-700nm, preferably 600nm, and is used as an intermediate layer to enhance the bonding strength of the interface.
[0025] The thickness of the Co-doped SiCNO thin film layer is 800-1000nm, and the optimum is 900nm. As the main pressure-sensitive material, it has the characteristics of large piezoresistive coefficient and high temperature resistance.
[0026] The thickness of the SiAlCN film layer is 100-300nm, preferably 200nm, which is used to enhance the adhesion between the piezores...
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