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Sensitive resistance pressure sensor chip and processing method thereof

A pressure sensor and sensitive resistor technology, applied in the field of microelectronics, to achieve the effect of good linearity, stable chemical properties and large piezoresistive coefficient

Pending Publication Date: 2020-06-26
SHENYANG ACAD OF INSTR SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Aiming at the problems of existing diffused silicon pressure sensor chips, the object of the present invention is to provide a pressure sensor chip with diamond as a sensitive resistance and a processing method. The sensor has good stability and can detect pressure at high temperatures. , can be applied to high temperature pressure detection under extreme conditions

Method used

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  • Sensitive resistance pressure sensor chip and processing method thereof
  • Sensitive resistance pressure sensor chip and processing method thereof
  • Sensitive resistance pressure sensor chip and processing method thereof

Examples

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Embodiment Construction

[0042] Depend on image 3 As shown, 0 in the figure is a single-crystal silicon substrate, and a silicon diaphragm is processed on the single-crystal silicon substrate layer 0, and 7 is a bonding pad area; a diamond sensitive resistor 5 is arranged inside the silicon diaphragm, and the silicon diaphragm A layer of oxide layer 4 for insulation between the diamond sensitive resistor and the substrate is separated from the side wall of the diamond sensitive resistor; the connection layer between the diamond sensitive resistor 5 and the silicon diaphragm is used to isolate the sensitive resistor from the silicon diaphragm Intrinsic Diamond 5. A silicon nitride layer 8 is also covered on the surface of the single crystal silicon substrate.

[0043] A layer of titanium gold electrode 9 for conducting electricity is connected above the diamond sensitive resistor 6 , and the cross-sectional structure at the bonding pad area 7 is consistent with that of the diamond sensitive resistor ...

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Abstract

The invention discloses a sensitive resistance pressure sensor chip and a processing method thereof. The sensor chip comprises a silicon diaphragm, a sensitive resistor and a pressure welding point which are processed on a monocrystalline silicon substrate layer, and is technically characterized in that a diamond sensitive resistor is arranged in the silicon diaphragm, and an oxide layer for insulation between the diamond sensitive resistor and the substrate is arranged between the silicon diaphragm and the side wall of the diamond sensitive resistor; and a connecting layer between the lower part of the diamond sensitive resistor and the silicon diaphragm is used for isolating intrinsic diamond from the silicon diaphragm. According to the method, a cleaned polished silicon wafer is sequentially subjected to oxidation, photoetching, etching and chemical vapor deposition to grow the diamond. The chip prepared by the invention has high sensor stability and can detect the pressure at a high temperature; and because of the excellent property of the diamond, the sensor chip can be applied to high-temperature pressure detection under extreme conditions. According to the invention, siliconis adopted as the diaphragm, and the diamond sensitive resistor grows in the diaphragm, so that excessive accumulation of stress is avoided, and the deformation quantity is also ensured.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a processing method for a chip of a sensitive resistance pressure sensor using diamond. The pressure sensor using diamond as a sensitive resistor has good stability and can detect pressure at high temperature. At the same time, due to the excellent properties of diamond, it can be applied to high temperature pressure detection under extreme conditions. Background technique [0002] Due to the large output signal, simple processing circuit, and the ability to measure pressure and differential pressure multi-faceted parameters, the diffused silicon pressure sensor chip has been valued by the industry. It has developed rapidly in the past ten years and occupies a considerable share in the sensor and transmitter market. Relying on the strong semiconductor industry foundation, developed countries have carried out in-depth research on the mechanism and application of diffused ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/18G01L1/22
CPCG01L1/18G01L1/2293
Inventor 贾文博张治国郑东明祝永峰任向阳海腾肖文英冯艳敏周聪
Owner SHENYANG ACAD OF INSTR SCI
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