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Epitaxial wafer of light emitting diode and preparation method thereof

A technology of light-emitting diodes and epitaxial wafers, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as low luminous efficiency, many epitaxial wafers, and poor crystal quality, so as to reduce dislocation defects, increase carrier concentration, The effect of improving crystal quality

Pending Publication Date: 2021-05-14
HC SEMITEK ZHEJIANG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, the epitaxial growth technology of ultraviolet LED is not mature enough, and there are many dislocation defects in the grown epitaxial wafer, resulting in poor crystal quality and low luminous efficiency.

Method used

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  • Epitaxial wafer of light emitting diode and preparation method thereof
  • Epitaxial wafer of light emitting diode and preparation method thereof
  • Epitaxial wafer of light emitting diode and preparation method thereof

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Embodiment Construction

[0031] In order to make the purpose, technical solution and advantages of the present disclosure clearer, the implementation manners of the present disclosure will be further described in detail below in conjunction with the accompanying drawings.

[0032] figure 1 It is a schematic structural diagram of an epitaxial wafer of a light emitting diode provided by an embodiment of the present disclosure. Such as figure 1 As shown, the epitaxial wafer includes a substrate 10 and a high temperature AlN buffer layer 20 , a transition layer 30 , an n-type AlGaN layer 40 , a multi-quantum well layer 50 and a p-type layer 60 sequentially formed on the substrate 10 .

[0033] Wherein, the transition layer 30 is a periodic structure. The periodic structure includes AlN layers 301 and AlGaN layers 302 stacked alternately, and the growth pressure of each AlGaN layer 302 decreases gradually along the epitaxial wafer growth direction.

[0034] By setting a transition layer between the high...

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Abstract

The invention provides an epitaxial wafer of a light emitting diode and a preparation method thereof, and belongs to the technical field of photoelectron manufacturing. The preparation method comprises the following steps of: providing a substrate; and sequentially and epitaxially growing a high-temperature AlN buffer layer, a transition layer, an n-type AlGaN layer, a multi-quantum well layer and a p-type layer on the substrate, wherein the transition layer is of a periodic structure, the periodic structure comprises AlN layers and AlGaN layers which are alternately stacked, and the growth pressure of each AlGaN layer is gradually reduced in the growth direction of an epitaxial wafer. The AlN layer in the transition layer can promote dislocation defect bending extending from the high-temperature AlN buffer layer and increase the dislocation annihilation probability, so that the purpose of reducing dislocation defects is achieved, the growth pressure of the first growing AlGaN layer is high, three-dimensional island-shaped growth of the AlGaN layer is promoted, and the growth pressure of the later growing AlGaN layer is low, so that the AlGaN layer is gradually transited to two-dimensional growth from three-dimensional growth, the dislocation density is reduced and the crystal quality is improved.

Description

technical field [0001] The disclosure relates to the technical field of optoelectronic manufacturing, in particular to an epitaxial wafer of a light emitting diode and a preparation method thereof. Background technique [0002] Light Emitting Diode (English: Light Emitting Diode, referred to as: LED), as a very influential new product in the optoelectronics industry, has the characteristics of small size, long service life, colorful colors, and low energy consumption. It is widely used in lighting, display screens , signal lights, backlight, toys and other fields. The core structure of the LED is the epitaxial wafer, and the production of the epitaxial wafer has a great influence on the photoelectric characteristics of the LED. [0003] Epitaxial wafers generally include buffer layers, n-type layers, multiple quantum well layers, and p-type layers. The n-type layer in the epitaxial wafer of the ultraviolet light emitting diode is usually an AlGaN layer. [0004] At presen...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/02H01L33/06H01L33/32
CPCH01L33/0095H01L33/0075H01L33/025H01L33/06H01L33/32
Inventor 丁涛龚程成尹涌梅劲
Owner HC SEMITEK ZHEJIANG CO LTD
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