Compound for lead bonding protection glue, preparation method of compound and quick-drying lead bonding protection glue
A wire bonding and compound technology, applied in the field of fast-drying wire bonding protective adhesive, can solve the problems of long curing time and limiting the capacity bottleneck of semiconductor packaging process.
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[0024] The present invention also provides a preparation method of the compound as described above, the preparation method comprising:
[0025] 1) under the condition that the catalyst exists, ricinoleic acid and glycidyl methacrylate are mixed and reacted by heating to obtain the first prepolymer;
[0026] 2) adding succinic anhydride to the first prepolymer for mixed reaction to obtain the second prepolymer;
[0027] 3) In the presence of a catalyst, mix the second prepolymer with glycidyl methacrylate and then heat to react to obtain the compound shown in formula I.
[0028] Specifically, the first prepolymer obtained in step 1) is shown in formula II, and the second prepolymer obtained in step 2) is shown in formula III:
[0029]
[0030] In a further preferred embodiment, in order to effectively improve the yield of the compound shown in formula I, the amount of each raw material needs to be further limited, specifically, relative to 1 mol of the ricinoleic acid, the ...
Embodiment 1
[0041] 1) in the flask of 500mL, add the GMA (glycidyl methacrylate) of 1mol, add and account for the 1% iron acetylacetonate of this step reaction raw material gross mass, stir, add the ricinoleic acid of 1mol after being warming up to 100 ℃, Under nitrogen protection, the temperature was raised to 150°C for 2 hours to obtain the first prepolymer;
[0042] 2) Add 1mol of succinic anhydride to a 500mL flask, raise the temperature to 60°C, slowly add the first prepolymer containing 1mol of OH groups into the succinic anhydride, raise the temperature to 80°C for 2 hours, and obtain the second prepolymer thing;
[0043] 3) Add 1mol GMA to a 500mL flask, add iron acetylacetonate accounting for 1% of the total mass of the reaction raw materials in this step, stir, and add the second prepolymer containing 1mol of COOH groups after the temperature is raised to 100°C, protect with nitrogen, and heat up to React at 150° C. for 3 h, and the obtained product is filtered to obtain compou...
Embodiment 2
[0046] The preparation was carried out according to the preparation method of Example 1, except that the amount of the first prepolymer was 0.8 mol, and the amount of the second prepolymer was 0.8 mol, to obtain compound A2 for wire bonding protective glue.
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