The invention relates to the technical field of
copper-clad plate preparation, and particularly discloses a high-thermal-
conductivity aluminum-based
copper-clad plate and a preparation method thereof.The high-thermal-
conductivity aluminum-based
copper-clad plate comprises an aluminum-based bottom plate and a prepreg, and the prepreg is prepared by thermally curing a heat-conducting glue solution and a
copper foil; the added heat-conducting glue solution contains a functional component and a modified heat-conducting filler, the functional component contains a
microcrystalline cellulose structure, a ricinoleate structure and pyridyl, and due to the existence of the
microcrystalline cellulose structure, on one hand, the high
crystallinity and orientation of the functional component are exerted, and on the other hand, the
microcrystalline cellulose structure can form
hydrogen-bond interaction with the modified heat-conducting filler, so that the heat-conducting property of the functional component is improved; the ricinoleate structure has orderliness, pyridyl can generate pi-
pi interaction with a
benzene ring on the modified heat-conducting filler, and due to the existence of the modified heat-conducting filler, on one hand, good heat
conductivity of
boron nitride is exerted, and on the other hand, octenyl
succinic anhydride grafted on the modified heat-conducting filler can generate chemical bonding with sulfydryl on the functional component, so that the heat conductivity of
boron nitride is improved. Through the synergistic effect of all the structures, the
thermal conductivity and the insulating property of the aluminum-based copper-clad plate are improved.