Low-volatility double-cross-linking heat-conducting phase change gel and preparation method thereof

Abstract

The invention discloses low-volatility double-cross-linking heat-conducting phase-change gel, which is characterized by comprising the following components in parts by weight: 1-30 parts of a resin A, 0.01-5 parts of a curing agent, 1-10 parts of a phase-change material, 0.1-2 parts of an antioxidant, 1-30 parts of a resin B, 0.01-5 parts of a cross-linking agent, 0.01-1 part of a catalyst and 100-300 parts of a heat-conducting filler. According to the invention, on the basis of silicone rubber and filler of original heat-conducting gel, an additional cross-linking curing system is introduced to achieve double-network cross-linking, and silicone rubber of different networks has a mutual dragging effect, so that volatilization of small molecules can be inhibited while it is guaranteed that the extrusion rate of the heat-conducting gel is high; a curing system of peroxide and silicone rubber is adopted, after a manufacturer completes curing to a certain degree, the product is made to be used at a client side, and the residual peroxide can still promote curing; and the phase change substance is introduced, and after phase change, the viscosity of the system is reduced, so that curing is promoted, the curing degree is improved, and volatilization of small molecules is further inhibited.

Description

technical field [0001] The invention relates to a phase-change heat-conducting material, in particular to a low-volatility double-crosslinked heat-conducting phase-change gel and a preparation method thereof. Background technique [0002] The 5G era has arrived, and electronic components are becoming more and more miniaturized and highly integrated, and their heat generation and heat flux density are also increasing. Studies have shown that: 1. For every 2°C increase in the operating temperature of the chip, the system stability will decrease by 10%; 2. More than 50% of electronic components fail due to excessive temperature. Therefore, people have been devoting themselves to solving the heat dissipation problem of electronic components for twenty years, and have done a lot of work on radiators, electronic components, and heat-conducting materials. [0003] Thermally conductive material is a material between electronic components and heat sinks that can transfer heat and re...

AI Technical Summary

Problems solved by technology

The side-chain hydrogen-containing polysiloxane refers to a side-chain hydrogen-containing polysiloxane with a viscosity of 10,000 to 200,000 mp*s and a hydrogen content of 0.05 to 1.6 wt %; more preferably, a viscosity of 100,000 mp*s and a hydrogen content of The amount of 0.18wt% side-chain hydrogen-containing polysiloxane and thermally conductive filler is combined to form a low-volatility thermally conductive gel. High-viscosity silicone rubber is used. Although the volatility can be significantly reduced, its viscosity is extremely high and it is difficult to extrude. out

[0009] Chinese patent publication CN110982277A "A single-component temperature-resistant heat-conducting silica mud composition and its preparation method", the vinyl polysiloxane used is vinyl-terminated polydimethylsiloxane or vinyl-terminated polymethyl Phenylsiloxane or a mixture of the two, with a viscosity of 100-1000mPa s, is combined with thermally conductive fillers to form a thermally conductive gel. Volatility-resistant phenylsiloxane is used to improve the volatility resistance, but the filling amount is relatively low. Vinyl siloxane will decrease, and the thermal conductivity is average

[0010] The above-mentioned patents use factors such as reducing the volatilization rate of raw materials, introducing polar groups or rigid structures to reduce the volatilization rate, and among them, prolonging the curing time and reasonable cross-linking are obvious effects and have not been applied.

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