Magnetron sputtering target gun with Halbach permanent magnet structure

Abstract

The invention discloses a magnetron sputtering target gun with a Halbach permanent magnet structure. The magnetron sputtering target gun comprises a water cooling component, a magnetic target base, an insulating ceramic plate, a magnetic target and a target cover, wherein a base is installed on a water cooling head, the magnetic target is placed on the base, an insulating plate is installed between the base and the magnetic target, the target cover is arranged outside the magnetic target in a sleeving mode, serves as a sputtering high-voltage cathode and plays a role in preventing a target material and the magnetic target from being polluted, the magnetic target base is formed by processing oxygen-free copper with a high thermal conductivity, a groove for accommodating a magnet group is formed in the magnetic target base and plays a role in fixing and cooling the magnetic target, the magnetic target is a permanent magnet group formed by arranging an axially magnetized annular permanent magnet, a radially magnetized annular or combined annular permanent magnet and an axially magnetized cylindrical permanent magnet according to a Halbach array structure, the Halbach permanent magnet group is arranged in the groove of the magnetic target base, and the target material is arranged above the permanent magnet group.

Description

technical field [0001] The invention relates to a magnetron sputtering target gun, in particular to a magnetron sputtering target gun with high magnetic flux, which can sputter various strong magnetic materials and can be used in an ultra-high vacuum cavity. Background technique [0002] Magnetron sputtering coating is a coating method for preparing metal, semiconductor, insulator, magnetic and non-magnetic thin films of various materials by physical vapor deposition and sputtering. Magnetron sputtering equipment is relatively simple and easy to control, and has the advantages of fast coating speed, good uniformity, high density and strong adhesion. It is a very effective thin film deposition method and is widely used in various industrial fields, especially the semiconductor industry. and the field of next-generation novel spintronics devices. [0003] In the magnetron sputtering system, the magnetron sputtering target gun is the core component. The stability of the magnet...

AI Technical Summary

Problems solved by technology

[0005] Purpose of the invention: In order to solve the defect that the magnetic field strength of the existing small-sized permanent magnet magnetron sputtering target gun is not enough, and it is impossible to grow strong magnetic materials under low sputtering pressure, the present invention is based on the patent No. CN210560702U target gun patent An important improvement has been made to the core part of the permanent magnet group, and a miniature magnetron sputtering target gun is designed by using the permanent magnet arrangement of the Halbach array structure to solve the problem of the existing coil magnetron sputtering target gun. The target gun is large and the structure is complex in the technology

Images