HJT low-temperature curing silver paste with dual curing performance and preparation method of HJT low-temperature curing silver paste
A dual curing and performance technology, applied in the field of solar cell materials, can solve the problems of difficult balance of adhesion and resistivity of silver electrode conductive film, low resistivity, poor adhesion effect, etc., to solve the problem of difficult balance of adhesion and resistivity , Improve electrical conductivity and strong adhesion
Active Publication Date: 2021-05-25
FOSHAN RAYNOVA MATERIALS TECH CO LTD +1
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Problems solved by technology
[0004] The HJT low-temperature curing silver paste of the prior art contains silver powder particles and between silver powder particles and the substrate are cured and bonded by epoxy resin or acrylic resin. When the resin content is high, the adhesion of the silver electrode is relatively good but the resistivity will be lower. High; when the resin content is low, the resistivity is low but the adhesion effect becomes poor
[0005] Therefore, the HJT low-temperature curing silver paste of the prior art has the defect that the adhesion and resistivity of the silver electrode conductive film are difficult to balance
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[0062] Further, the present invention also proposes a method for preparing the above-mentioned HJT low-temperature curing silver paste with dual curing properties, comprising the following steps:
[0063] S1) Calculated in parts by weight, respectively weigh the main conductive silver powder, auxiliary conductive silver powder, acrylic resin, epoxy resin, solvent, initiator and curing agent, mix and stir evenly to prepare a mixture;
[0064] S2) Send the mixture obtained in S1) into a three-roll mill for rolling and dispersing evenly, so as to obtain the HJT low-temperature curing silver paste with dual curing properties.
[0065] The preparation process is simple and the production cost is low.
[0066] Specifically, in step S2), the viscosity of the HJT low-temperature curing silver paste with dual curing performance is 200-260 Pa·s.
[0067] The HJT low-temperature curing silver paste with double curing performance controlled by the present invention has suitable fluidity,...
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Abstract
The invention discloses HJT low-temperature curing silver paste with dual curing performance and a preparation method thereof, and the HJT low-temperature curing silver paste comprises the following raw materials in parts by weight: 70-90 parts of main conductive silver powder, 1-10 parts of auxiliary conductive silver powder, 1-10 parts of acrylate resin, 1-10 parts of epoxy resin, 1-5 parts of a solvent, 0.1-1 part of an initiator and 0.1-2 parts of a curing agent. The main conductive silver powder is micron-sized silver powder; the auxiliary conductive silver powder is nanoscale silver powder, and the silver electrode formed after curing has good conductivity and adhesive force. The invention further provides a preparation method of the HJT low-temperature curing silver paste with the dual curing performance, the process is simple and effective, and the manufacturing cost advantage is good.
Description
technical field [0001] The invention relates to the technical field of solar cell materials, in particular to a HJT low-temperature curing silver paste with dual curing properties and a preparation method thereof. Background technique [0002] HJT solar photovoltaic cell is a new type of solar cell based on a thin silicon substrate. Its photoelectric conversion efficiency record has reached about 25%, which is much higher than the conversion efficiency of traditional crystalline silicon solar cells, and has a good market prospect. [0003] The metal silver electrode manufacturing process of the heterojunction HJT solar photovoltaic cell is to cure the HJT low-temperature curing silver paste on the top layer on both sides of the cell by screen printing or electroplating technology, and the structure of the silver electrode is symmetrical. When the curing temperature exceeds 250°C, it is easy to damage the internal battery structure. Therefore, the curing temperature of the HJ...
Claims
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Login to View More IPC IPC(8): H01B1/22H01B13/00H01L31/0224
CPCH01B1/22H01B13/00H01L31/022425
Inventor黄剑敏吕文辉刘家敬黄良辉杨至灏
OwnerFOSHAN RAYNOVA MATERIALS TECH CO LTD