Method for inhibiting hole defects of uniform metal microdroplet jet 3D printing
A 3D printing and droplet jetting technology, applied in the direction of additive manufacturing, additive processing, etc., can solve the problems of difficult to complete small gaps, difficult to discharge and fill air bubbles, and achieve the effect of breaking through technical bottlenecks
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Embodiment 1
[0051] The method for suppressing hole defects in uniform metal droplet jetting 3D printing is characterized in that it comprises the following steps:
[0052] 1) Select metal or alloy as the printing raw material, and process the scale and impurities on the surface of the printing raw material. Use a combination of surface mechanical grinding and acid-base corrosion to remove scale and impurities on the surface of the printed raw material.
[0053] 2) Supply the processed printing raw material to the on-demand uniform metal droplet generator. Among them, see figure 1 , the on-demand uniform metal droplet generator 1 is arranged in a low-oxygen and low-water environment 11 . An induction heater 2 is arranged on the outer wall of the on-demand uniform metal droplet generator 1 . The bottom of the on-demand uniform metal droplet generator 1 is provided with a nozzle 3 . The inner diameter of the nozzle 3 can be selected within the range of 1-1000 μm. The on-demand uniform m...
Embodiment 2
[0072] In this embodiment, Embodiment 1 is applied to the printing and forming of high-density block parts of 7075 aluminum alloy. The main steps of this embodiment are the same as those in Embodiment 1.
[0073] In this embodiment, by controlling the coordinated movement of the X-axis and Y-axis of the three-dimensional workbench 10, the nozzle 3 is positioned and focused to the initial deposition position, and the Z-axis of the three-dimensional workbench 10 is controlled so that the distance between the nozzle 3 and the deposition substrate 7 The distance is 30mm.
[0074] Cutting the 7075 aluminum alloy bar stock in the market supply state, so that it can be smoothly put into the on-demand uniform metal droplet generator 1, and the surface scale and impurities are removed by grinding technology and acid-base corrosion method. Then put it into the on-demand uniform metal droplet generator 1 and seal it.
[0075] The entire printing working space 11 is deoxygenated and deh...
Embodiment 3
[0077] In this embodiment, Embodiment 1 is applied to Sn60Pb40 tin-lead alloy high-reliability bump array jet printing forming. The main steps of this embodiment are the same as those in Embodiment 1.
[0078] In this embodiment, the jet printing material is replaced with Sn60Pb40 tin-lead alloy for electronic packaging, the heating temperature of the induction heater 2 is controlled to be 350-400°C, and when the heating plate 8 preheats the deposition substrate 7, the preheating temperature is controlled The temperature is 50°C. The bump array is composed of a series of discrete single deposited metal droplets. The printing does not involve a layer-by-layer printing process. The deposition position of each charged metal droplet 5 must be arranged according to actual needs, and the deposition substrate 7 needs to be based on Electronic packaging requires special selection. When the deposition substrate 7 is a metal material, it can be directly connected to the positive pole ...
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