Liquid cooling plate and heat dissipating equipment

A technology of heat dissipation equipment and liquid cold plate, which is applied in the direction of lighting and heating equipment, electrical equipment structural parts, cooling/ventilation/heating transformation, etc., and can solve the problems of high pressure in the two-phase system, excessive chip temperature, and overcooling. Achieve the effect of reducing the thermal resistance of convective heat transfer, achieving temperature uniformity and improving the cooling effect

Pending Publication Date: 2021-06-04
ZTE CORP
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  • Application Information

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Problems solved by technology

However, the existing two-phase liquid usually has the problem of overcooling when it enters the cold plate, and the one-way heat transfer is larger than the two-phase heat transfer thermal resistance, which will cause the uniformity of the inlet heat dissipation unit and other heat dissipation units to decrease; and bec

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  • Liquid cooling plate and heat dissipating equipment
  • Liquid cooling plate and heat dissipating equipment
  • Liquid cooling plate and heat dissipating equipment

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Embodiment Construction

[0031] In order to make the purpose, technical solution and advantages of the application clearer, the embodiments of the application will be described in detail below in conjunction with the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined arbitrarily with each other. In the embodiment of this application, the liquid cooling plate is a heat dissipation structure based on a phase-change working medium fluid circuit based on flowing boiling heat transfer, which can solve the problems of high local heat flux density and large-scale heat transfer. The two-phase liquid cooling technology has the following advantages:

[0032] 1. High heat exchange density. The boiling heat transfer coefficient can reach 1-10W / cm K, which is an order of magnitude higher than that of single-phase.

[0033] 2. High heat transfer capacity. The phase change process utilizes the la...

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Abstract

The invention provides a liquid cooling plate and heat dissipating equipment. The liquid cooling plate comprises a single-phase channel and a two-phase channel. First fins are arranged at an interval in the single-phase channel, and second fins are arranged at an interval in the two-phase channel. A liquid state cooling liquid exchanged in heat by the first fins in the single-phase channel becomes a gas-liquid two phase cooling liquid and is then output by the second fins in the two-phase channel after heat exchange. According to the technical scheme, the gas-liquid two phase cooling liquid is exchanged in heat again via the two phase channel, so that the temperature difference between a heat dissipating object and the cooling liquid is reduced, the convection heat exchange heat resistance is reduced, the cooling effect is improved, and a supercooling problem in the heat dissipating process can be prevented.

Description

technical field [0001] The present application relates to the technical field of liquid cooling and heat dissipation, in particular to a liquid cold plate and heat dissipation equipment. Background technique [0002] With the continuous development of communication technology, the power consumption of electronic equipment continues to increase. The power consumption of a single cabinet has increased from 3 to 4KW in the past to the order of hundreds of kilowatts, and the heat flux has reached 20W / cm 2 Above, air cooling and single-phase liquid are difficult to meet the high-reliability heat dissipation requirements of future high-heat-flux electronic products, and temperature control has become a key factor restricting its development. [0003] The phase-change fluid circuit cooling system based on flow boiling heat transfer has significant advantages over single-phase heat transfer in solving high local heat flux density and large-scale heat transfer. The two-phase fluid ci...

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Application Information

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IPC IPC(8): F28D15/02H05K7/20
CPCF28D15/025H05K7/20336H01L23/473H01L23/427H01L23/3733F28D15/046F28D2015/0291H05K7/20309H05K7/20681H05K7/20318H05K7/20327H05K7/2039
Inventor 刘帆陶成李帅
Owner ZTE CORP
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