Liquid cooling plate and heat dissipating equipment

Abstract

The invention provides a liquid cooling plate and heat dissipating equipment. The liquid cooling plate comprises a single-phase channel and a two-phase channel. First fins are arranged at an interval in the single-phase channel, and second fins are arranged at an interval in the two-phase channel. A liquid state cooling liquid exchanged in heat by the first fins in the single-phase channel becomes a gas-liquid two phase cooling liquid and is then output by the second fins in the two-phase channel after heat exchange. According to the technical scheme, the gas-liquid two phase cooling liquid is exchanged in heat again via the two phase channel, so that the temperature difference between a heat dissipating object and the cooling liquid is reduced, the convection heat exchange heat resistance is reduced, the cooling effect is improved, and a supercooling problem in the heat dissipating process can be prevented.

Description

technical field [0001] The present application relates to the technical field of liquid cooling and heat dissipation, in particular to a liquid cold plate and heat dissipation equipment. Background technique [0002] With the continuous development of communication technology, the power consumption of electronic equipment continues to increase. The power consumption of a single cabinet has increased from 3 to 4KW in the past to the order of hundreds of kilowatts, and the heat flux has reached 20W / cm 2 Above, air cooling and single-phase liquid are difficult to meet the high-reliability heat dissipation requirements of future high-heat-flux electronic products, and temperature control has become a key factor restricting its development. [0003] The phase-change fluid circuit cooling system based on flow boiling heat transfer has significant advantages over single-phase heat transfer in solving high local heat flux density and large-scale heat transfer. The two-phase fluid ci...

AI Technical Summary

Problems solved by technology

However, the existing two-phase liquid usually has the problem of overcooling when it enters the cold plate, and the one-way heat transfer is larger than the two-phase heat transfer thermal resistance, which will cause the uniformity of the inlet heat dissipation unit and other heat dissipation units to decrease; and because the two-phase system The pressure is relatively high, the channel structure optimization method inside the cold plate is limited, and the convective heat transfer area for heat dissipation is limited. When it is used to cool down the cabinet, there is a risk that the temperature of the chip will exceed the standard.

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