Single-component solvent-free hot melt adhesive for lamp switch as well as preparation method and use method thereof

A lamp switch and hot melt adhesive technology, applied in the direction of adhesives, adhesive types, adhesive additives, etc., can solve problems such as insufficient bonding ability, rapid viscosity drop, hidden dangers to human safety, etc., to improve pollution and reduce environmental protection disposal costs, and the effect of avoiding potential safety hazards

Inactive Publication Date: 2021-06-08
WUXI LAIEN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The object of the present invention is to provide a single-component solvent-free hot-melt adhesive for lamp switch and its preparation method and use method. There is a problem of potential safety hazards, and it also solves the problems of rapid viscosity drop and insufficient bonding ability of solvent-free hot melt adhesives at high temperatures in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Embodiment 1: A kind of one-component solvent-free hot-melt adhesive for lamp switch, described hot-melt adhesive is made up of the raw material of following parts by weight: 40 parts of polyphenyl polymethylene polyisocyanate and hexamethylene di A mixture of isocyanates, 70 parts of epoxy acrylic modified saturated polyester, 10 parts of polyoxypropylene triol, 2 parts of vinyl-terminated polydimethylsiloxane, 1 part of chain extender, 1 part of curing agent, 1 part of polycarbodiimide, 1 part of adhesion promoter, 0.1 part of catalyst and 0.1 part of antioxidant.

[0031] The average molecular weight of the epoxy acrylic modified saturated polyester is 3000; the polyoxypropylene triol is 3000; the vinyl content of the vinyl-terminated polydimethylsiloxane is 0.3 mol%.

[0032] The chain extender is 1,4-butanediol, 1,6-hexanediol, glycerol, trimethylolpropane, diethylene glycol, triethylene glycol, neopentyl glycol, sorbitol, diethylaminoethanol , 3,3'-dichloro-4,4'-...

Embodiment 2

[0052] Embodiment 2: A kind of one-component solvent-free hot-melt adhesive for lamp switch, described hot-melt adhesive is made up of the raw material of following parts by weight: 45 parts of polyphenyl polymethylene polyisocyanate and hexamethylene di A mixture of isocyanates, 80 parts of epoxy acrylic modified saturated polyester, 15 parts of polyoxypropylene triol, 3.5 parts of vinyl-terminated polydimethylsiloxane, 3 parts of chain extender, 1 part of curing agent, 2 parts of polycarbodiimide, 1 part of adhesion promoter, 0.3 part of catalyst and 0.2 part of antioxidant.

[0053] The average molecular weight of the epoxy acrylic modified saturated polyester is 3500; the polyoxypropylene triol is 3500; the vinyl content of the vinyl-terminated polydimethylsiloxane is 0.4 mol%.

[0054] The chain extender is 1,4-butanediol, 1,6-hexanediol, glycerol, trimethylolpropane, diethylene glycol, triethylene glycol, neopentyl glycol, sorbitol, diethylaminoethanol , 3,3'-dichloro-4...

Embodiment 3

[0074] Embodiment 3: a kind of one-component solvent-free hot-melt adhesive for lamp switch, described hot-melt adhesive is made up of the raw material of following parts by weight: 50 parts of polyphenyl polymethylene polyisocyanate and hexamethylene di A mixture of isocyanates, 90 parts of epoxy acrylic modified saturated polyester, 20 parts of polyoxypropylene triol, 5 parts of vinyl-terminated polydimethylsiloxane, 5 parts of chain extender, 2 parts of curing agent, 3 parts of polycarbodiimide, 2 parts of adhesion promoter, 0.5 parts of catalyst and 0.3 parts of antioxidant.

[0075] The average molecular weight of the epoxy acrylic modified saturated polyester is 4000; the polyoxypropylene triol is 4000; the vinyl content of the vinyl-terminated polydimethylsiloxane is 0.5 mol%.

[0076] The chain extender is 1,4-butanediol, 1,6-hexanediol, glycerol, trimethylolpropane, diethylene glycol, triethylene glycol, neopentyl glycol, sorbitol, diethylaminoethanol , 3,3'-dichloro...

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Abstract

The invention discloses a single-component solvent-free hot melt adhesive for a lamp switch as well as a preparation method and a use method thereof. The hot melt adhesive is prepared from following raw materials in parts by weight: 40 to 50 parts of a mixture of polyphenyl polymethylene polyisocyanate and hexamethylene diisocyanate, 70 to 90 parts of epoxy acrylic acid modified saturated polyester, 10 to 20 parts of polyoxypropylene triol, 2 to 5 parts of vinyl-terminated polydimethylsiloxane, 0.1 to 5 parts of a chain extender, 0.1 to 2 parts of a curing agent, 0.1 to 3 parts of polycarbodiimide, 0.1 to 2 parts of an adhesion promoter, 0.1-0.5 part of a catalyst, and 0.1-0.3 part of an antioxidant. According to the invention, no organic solvent or double-component A-type substances need to be added, the VOC emission can be greatly reduced, the environmental pollution caused by the hot melt adhesive is effectively reduced, the viscosity of the prepared hot melt adhesive at 80 DEG C is 7500 mpa.s, the NOC% measured according to the weight ratio is 6.2%, and the hot melt adhesive is not easy to flow at high temperature and has good stability.

Description

technical field [0001] The invention relates to a single-component solvent-free hot-melt adhesive for a lamp switch, a preparation method and a use method thereof, and belongs to the technical field of hot-melt adhesives. Background technique [0002] In industrial production, it is often necessary to use adhesives to realize materials and composites. Common composite adhesives are divided into solvent-based adhesives and solvent-free adhesives, and both solvent-based adhesives and solvent-free adhesives can be realized in the form of one-component or two-component. And according to the composition of the formula, it can be divided into heating and non-heating forms. [0003] In some typical lamination fields, such as metal lamination, the metal plate lamination technology is a processing technology that pastes the plastic film on the metal plate by hot pressing the plastic film and the metal plate at high temperature. The film lamination technology was born in 1977. In Jap...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): C09J175/04C09J11/08C08G18/76C08G18/73C08G18/66C08G18/48C08G18/68C08G18/12C08G18/34
CPCC09J175/04C09J11/08C08G18/7664C08G18/73C08G18/724C08G18/4829C08G18/68C08G18/12C08L2203/20
Inventor张来
OwnerWUXI LAIEN TECH