An online control method for flexible pcb board etching process based on wet chemical etching simulation

A PCB board, wet chemical technology, applied in the field of online control of flexible PCB board etching process, can solve the problems of semi-finished product scrap processing cost, enterprise loss, monitoring of production line process problems, etc., to avoid batch problems and reduce production costs.

Active Publication Date: 2022-06-07
WUHAN UNIV
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if a certain etching process parameter is wrong, and then the AOI system detects a circuit quality problem, the circuit boards produced in this batch will not be usable, which will cause the scrapping of semi-finished products and increase the processing cost, which will undoubtedly cause damage to the enterprise. Additional losses that significantly reduce the profit margin of the business
The current AOI inspection method is to carry out quality inspection after the etching process is completed, which has a certain lag. This method is effective for improving product quality, but it is difficult to monitor the process problems of the earlier production line

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An online control method for flexible pcb board etching process based on wet chemical etching simulation
  • An online control method for flexible pcb board etching process based on wet chemical etching simulation
  • An online control method for flexible pcb board etching process based on wet chemical etching simulation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art fall within the protection scope of the present invention. In the present invention, the copper film is used as the etching substrate, the photoresist is used as the mask, and the CuCl is used as the etching substrate. 2 The solution will be described as an example of an etching solution.

[0027] like figure 1 and figure 2 As shown, it is an on-line control method of flexible PCB board etching process based on wet chemical etching simulation, which mainly includes the following steps:

[0028] S1. Build a physical mode...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an online control method of flexible PCB board etching process based on wet chemical etching simulation. The method utilizes multi-physics field finite element simulation software to construct an equivalent two-dimensional geometric model of a flexible PCB board, and establishes a multi-physics field simulation model , complete the setting of material properties, boundary conditions and initial conditions and perform simulation. By using the process parameter data that may appear in various production lines as the simulation boundary conditions, the process parameter data of various possible permutations and combinations are input into the simulation system as the simulation parameter data and the simulation calculation is performed to obtain a one-to-one correspondence between the simulation parameter data and the simulation results database. Then match the production line data collected in real time with the simulation parameter data in the database, and retrieve the corresponding simulation results. If the simulation results exceed the product indicators, stop production and adjust the process data, so as to monitor the process problems of the earlier production line. Complete online adjustment of process parameters.

Description

technical field [0001] The invention belongs to the field of optoelectronics and relates to a PCB board production process technology, in particular to an online control method for a flexible PCB board etching process based on wet chemical etching simulation. Background technique [0002] A flexible PCB board is a printed circuit board made of a flexible substrate, which has the characteristics of high reliability and excellent flexibility. At present, flexible PCB boards have been widely used in terminal consumption fields such as smartphones, automobiles, and wearable devices. With the rapid development of high integration and high precision of internal components such as personal computers and smartphones in recent years, as an electrical component Flexible PCB boards for device connectors will also accelerate the pace of high density. The production process of flexible PCB boards is generally: punching → coating → exposure → development → etching → film stripping → tinn...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/398G06F115/12G06F113/08G06F119/14
CPCG06F30/398G06F2115/12G06F2113/08G06F2119/14Y02P90/02
Inventor 李辉申胜男张宇盛家正
Owner WUHAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products