Laser processing method for improving morphology quality of ceramic surface holes
A laser processing method and laser processing technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems affecting the thickness of copper film and connection strength, uneven thickness of copper film, and affecting the quality of hole morphology, etc. To achieve the effect of guaranteeing performance and improving shape quality
Pending Publication Date: 2021-06-18
SHANGHAI UNIV OF ENG SCI
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Problems solved by technology
However, due to the unavoidable thermal influence in laser processing and the hindering effect of laser-induced particle clusters on material splashing, problems such as layered slag may appear on the side wall of the hole under short-pulse laser processing, which seriously affects the hole quality. The quality of the morphology will affect the thickness and connection strength of the copper film during the subsequent metallization of the surface of the ceramic substrate, resulting in uneven thickness of the copper film, poor connection strength or even overall shedding, etc., affecting the performance of the ceramic substrate
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Embodiment
[0034] Embodiment: Carry out hole processing to ceramic substrate surface by following steps:
[0035] (1) Build a nanosecond laser processing system;
[0036] (2) Put an aluminum nitride ceramic substrate with a length, width, and thickness of 50*50*0.38mm into acetone for ultrasonic cleaning, then use distilled water to dry it with compressed air, and place it on a moving platform;
[0037] (3) Use a short-pulse nanosecond laser to process holes on the surface of the ceramic substrate;
[0038] (4) Set the adjustment parameters of the nanosecond laser processing system, including pulse width ≤ 15ns, laser wavelength 355-532nm, laser power ≤ 25W, repetition frequency ≤ 60kHz, scanning speed 0<v≤1000mm / s, scanning times 1< N≤100, laser jump speed 1000mm / s<v0≤10000mm / s. In this embodiment, the laser wavelength is set to 355nm, the laser power is 7W, the repetition frequency is 50kHz, the pulse width is 12ns, the scanning speed is 20mm / s, the number of scanning times is 15, an...
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The invention relates to a laser processing method for improving the morphology quality of ceramic surface holes, and belongs to the technical field of laser processing. The laser processing method for improving the morphology quality of the ceramic surface holes is characterized by comprising the following steps of: s1, building a laser processing system; s2, selecting a ceramic substrate, placing the ceramic substrate in acetone, and cleaning the ceramic substrate with ultrasonic waves; s3, taking out the ceramic substrate, washing the ceramic substrate with distilled water, blow-drying the ceramic substrate with compressed air, and putting the ceramic substrate into the laser processing system; and s4, setting short-pulse nanosecond laser parameters, and performing filling type hole processing on the surface of the ceramic substrate by using short-pulse nanosecond laser by taking a plurality of concentric circles as tracks. According to the laser processing method for improving the morphology quality of the ceramic surface holes provided by the invention, the short-pulse nanosecond laser is used as an energy source, and the appearance quality of holes in the surface of the ceramic substrate can be remarkably improved by adopting a special laser processing track, so that a guarantee is provided for subsequent metallization of the surface of the ceramic substrate, and the performance of the ceramic substrate is guaranteed.
Description
technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a laser processing method for improving the quality of ceramic surface hole topography. Background technique [0002] Direct Plated Copper (DPC, Direct Plated Copper) has the characteristics of high precision circuit and high surface flatness. Combined with high thermal conductivity alumina or aluminum nitride ceramic substrate, it is the most suitable heat dissipation substrate for the development of high-power, large-scale LED and other light sources. . In order to realize the conduction function of the ceramic substrate, it is first necessary to drill holes on the surface of the alumina or aluminum nitride ceramic substrate, and after cleaning, use magnetron sputtering technology to plate copper on the surface of the ceramic substrate to achieve metallization on the surface of the ceramic substrate. , therefore, the topographical quality of the holes has ...
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IPC IPC(8): B23K26/382B23K26/40B23K26/60B23K26/064B23K26/0622
CPCB23K26/382B23K26/402B23K26/60B23K26/064B23K26/0622B23K26/0643B23K2103/52
Inventor 付萍赵万芹何汉林师永成袁权王宗禹
Owner SHANGHAI UNIV OF ENG SCI