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Graphene high-thermal-conductivity material

A graphene, high thermal conductivity technology, applied in the field of graphene, can solve the problems of product brittleness, low thermal conductivity, easy cracking, etc., and achieve the effect of reducing the usage amount, improving the distribution structure, and improving the cohesion of the adhesive layer.

Pending Publication Date: 2021-06-18
重庆索梦得新材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] When the existing graphene materials are applied to existing electronic products, the thermal conductivity is generally within 1W / (m K) and the thermal conductivity is low. In order to improve the thermal conductivity of the product when it is 2W / (m K) and above The bond strength drops sharply and can only reach 20% of the original. At the same time, when graphene is applied to ordinary thermal conductive fillers, the product is brittle and easy to crack

Method used

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Embodiment Construction

[0024] The raw material component (every component=1g) of a kind of graphene heat-conducting material in embodiment one~three is as follows:

[0025]

[0026]

[0027] The preparation steps of above-mentioned a kind of graphene heat-conducting material are as follows:

[0028] Step 1: add nanotubular graphene, bisphenol A epoxy resin and bisphenol F epoxy resin in double planetary mixer, by double planetary mixer with the rotating speed of 3000r / s, to bisphenol A epoxy resin and bisphenol F The epoxy resin was stirred for 2 hours to dehydrate, heated to 90°C during the stirring process, and evacuated to 0.1MPa to form the first mixture;

[0029] Step 2: Add the modified mercaptan curing agent to the first mixture, and stir the first mixture and the modified mercaptan curing agent for 1 hour to dehydrate the first mixture and the modified mercaptan curing agent through a double planetary mixer at a speed of 3000 r / s, and heat to 90°C, and vacuum 0.1MPa to form the second...

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Abstract

The invention relates to the technical field of graphene, and discloses a graphene high-thermal-conductivity material which comprises the following raw material components: 10-16 parts of nano tubular graphene, 20-30 parts of bisphenol A epoxy resin, 30-40 parts of bisphenol F epoxy resin, 20-30 parts of a modified thiol curing agent, 3-6 parts of hydrophobic fumed silica and 1-3 parts of a catalyst. Compared with the existing graphene heat conduction material, the graphene high-thermal-conductivity material disclosed by the invention is high in heat conduction coefficient and high in bonding strength.

Description

technical field [0001] The invention relates to the technical field of graphene, and specifically discloses a graphene high thermal conductivity material. Background technique [0002] Graphene is a sp 2 A new material in which hybrid-connected carbon atoms are tightly packed into a single-layer two-dimensional honeycomb lattice structure. Graphene has excellent optical, electrical, and mechanical properties, and has important application prospects in materials science, micro-nano processing, energy, biomedicine, and drug delivery, and is considered to be a revolutionary material in the future. [0003] When the existing graphene materials are applied to existing electronic products, the thermal conductivity is generally within 1W / (m K) and the thermal conductivity is low. In order to improve the thermal conductivity of the product when it is 2W / (m K) and above The bond strength drops sharply and can only reach 20% of the original value. At the same time, when graphene is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C08G59/66
CPCC09J163/00C09J11/04C08G59/66C08K2201/011C08L2205/025C08L2201/08C08L2201/04C08L63/00C08K3/042C08K7/24C08K3/36
Inventor 马月春
Owner 重庆索梦得新材料科技有限公司
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