Efficient light flexible heat conduction chain based on graphene macroscopic assembly film

A heat conduction chain and graphene technology, applied in the field of heat conduction chain, can solve problems such as difficult to cover normal temperature to deep low temperature area, difficult to apply vibration reduction requirements, heavy weight, etc., and achieve the effect of three-dimensional conformal arrangement and high thermal conductivity

Active Publication Date: 2021-06-18
ZHEJIANG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Traditional metal-based cold chains or heat pipes are heavy in weight and high in rigidity, while the thermal conductivity of metal-based cold chains in the 60K-220K temperature range is usually low, less than 400W / mK, and the current heat pipe technology is difficult to cover from room temperature to deep In the low temperature area, there is also a big gap between the flexibility and the graphene film cold chain, so it is difficult to meet the needs of vibration reduction

Method used

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  • Efficient light flexible heat conduction chain based on graphene macroscopic assembly film
  • Efficient light flexible heat conduction chain based on graphene macroscopic assembly film
  • Efficient light flexible heat conduction chain based on graphene macroscopic assembly film

Examples

Experimental program
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Effect test

Embodiment 1

[0036] Such as image 3 As shown, the heat conduction chain involved in this embodiment includes a graphene film composed of a plurality of graphene layers 1 and a normal heat conduction layer located between the graphene layers 1, and the normal heat conduction layer includes a solder layer 8, so The solder layer 8 is connected to the surface of the graphene layer 1 through the magnetron sputtering metal layer 7 and the metal transition layer 6; located at the cold and hot ends. The middle part of the graphene film does not have the above-mentioned solder layer 8 .

[0037] In practical application, the ends of the above-mentioned heat conduction chains are encapsulated in the casing, which are respectively the hot end casing and the cold end casing, such as figure 1 and 2As shown, wherein, the cold end shell includes the cold end joint 4, the cold end joint cover plate 5, the hot end shell includes the hot end joint 2 and the hot end joint cover plate 3 of the hot end, an...

Embodiment 2

[0047] Such as Figure 5 As shown, the heat conduction chain involved in this embodiment includes a graphene film composed of a plurality of graphene layers 1 and a normal heat conduction layer located between the graphene layers 1, and the normal heat conduction layer includes a solder layer 8, so The solder layer 8 is connected to the surface of the graphene layer 1 through the magnetron sputtering metal layer 7 and the metal transition layer 6; located at the cold and hot ends. The middle part of the graphene film does not have the above-mentioned solder layer 8 .

[0048] In this embodiment, the thickness of a single graphene layer 1 is 25 μm to 30 μm, the carbon-oxygen ratio is greater than 99.8, ID / IG is less than 0.1, the interlayer distance is not greater than 0.336 nm, and the width of one end is 8 cm, which is used as the cold end, and the size of the other end is 12 cm as the hot end. (Purchased from Hangzhou Gaoxi Technology Co., Ltd., product model: GX-HT-1300)...

Embodiment 3

[0057] Such as Figure 7 As shown, this embodiment is the same as Embodiment 2, the difference is that the columnar protrusions are arranged on the cover plate of the cold end joint and the cover plate of the hot end joint, and the clearance fit is adopted between the columnar protrusion and the through hole, and the gap is filled with a metal medium (melting gold tin solder or silver tin solder).

[0058] Test results such as Figure 8 , it can be seen that compared with the metal-based cold chain commonly used in my country's aerospace industry, the thermal conductivity in the 80K-220K temperature zone is increased by 2-3 times, and the heat flux is increased to 7-8 times when the mass and length are the same .

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Abstract

The invention discloses a heat conduction chain, and relates to the field of an efficient light flexible heat conduction chain based on a graphene macroscopic assembly film, and the heat conduction chain comprises a graphene film composed of a plurality of graphene layers and a normal heat conduction layer located between the graphene layers; and the two ends of the heat conduction chain are a cold end and a hot end respectively, and the normal heat conduction layer is located at the cold end and the hot end. By the adoption of the scheme, light weight, high flexibility and high heat conductivity of the heat conduction chain can be achieved, meanwhile, effective vibration isolation is achieved, and light weight, high efficiency, easy implementation and high reliability of a space refrigeration system can be achieved.

Description

technical field [0001] The invention relates to a heat conduction chain, in particular to a high-efficiency, lightweight and flexible heat conduction chain based on a graphene macro-assembled film. Background technique [0002] Heat conduction links are often used for heat transfer between the focal plane of a space camera and the cold finger of a refrigerator, or between a heat source and a radiation cooling surface. At present, cold chain (also called heat conduction chain) materials are mainly carbon-based cold chains and metal-based cold chains. Metal materials have high density and low thermal conductivity (the thermal conductivity of silver, copper, and aluminum at room temperature is only 430W / mK, 400W / mK, 238W / mK), metal materials with high density, high stiffness, and low thermal conductivity are difficult to meet the application requirements of high thermal conductivity, light weight and high flexibility. [0003] Pyrolytic graphite film and calendered film are a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14B32B9/00B32B9/04B32B3/24B32B15/04B32B33/00
CPCB32B3/266B32B9/007B32B9/041B32B15/04B32B33/00B32B2307/302C09K5/14
Inventor 高超周吉刘英军刘志敏许震王振营何广腾
Owner ZHEJIANG UNIV
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