Low-reflectivity COB packaging structure

A packaging structure and low reflectivity technology, which is applied to lighting devices, air-proof/waterproof devices, lighting device components, etc., can solve problems such as low reflectivity, uneven chip power, and inconspicuous lighting effects, and achieve cost-effective Low, high luminous efficacy and high lumen density, to achieve the effect of luminous efficacy and high lumen density

Active Publication Date: 2021-06-22
TONGHUI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The traditional flip-chip COB packaging structure also has some shortcomings, such as high reflectivity, uneven power

Method used

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  • Low-reflectivity COB packaging structure
  • Low-reflectivity COB packaging structure
  • Low-reflectivity COB packaging structure

Examples

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Embodiment

[0021] Example: such as Figure 1-3 As shown, a low-reflectivity COB packaging structure of the present invention includes a base 1, a circuit board 8 is mounted on the base 1, and an LED chip 10 is mounted on the surface of the circuit board 8, and a sealing sleeve 3 is provided directly above the base 1. And the surface of the sealing sleeve 3 is fixedly connected with a protective glass 6, and the surface of the base 1 is equipped with a plurality of clamping blocks 2, and the clamping blocks 2 are respectively fixedly connected to the middle of each side of the base 1, and the cross section of the clamping blocks 2 is " L"-shaped structure, and the limit slant plate 12 is movable in the clamping block 2, and a plurality of clamping plates 4 are fixedly installed on the surface of the sealing sleeve 3, and the clamping plates 4 and the clamping blocks 2 are set in one-to-one correspondence, and the surface of the LED chip 10 Be coated with sealant 9.

[0022] Wherein, one ...

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PUM

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Abstract

The invention discloses a low-reflectivity COB packaging structure which comprises a base, a circuit board is installed on the base, an LED chip is installed on the surface of the circuit board, a sealing sleeve is arranged over the base, protective glass is fixedly connected to the surface of the sealing sleeve, a plurality of clamping blocks are installed on the surface of the base, the clamping blocks are fixedly connected to the middles of the edges of the base respectively, the cross section of each clamping block is of an L-shaped structure, a limiting inclined plate is movably arranged in each clamping block, a plurality of clamping plates are fixedly installed on the surface of the sealing sleeve, and the clamping plates and the clamping blocks are arranged in a one-to-one correspondence mode. According to the low-reflectivity COB packaging structure, the protective glass with the coating on the surface is adopted, the light transmittance is good, the weather resistance is good, the illumination brightness is greatly improved, the cost is low, although the manufacturing process is simple and the cost is low, the optical fiber antireflection coating on the surface can effectively reduce the light transmittance, the power increment is not high, and the chip area and the substrate size are the same.

Description

technical field [0001] The invention relates to the technical field of COB, in particular to a COB packaging structure with low reflectivity. Background technique [0002] LED (Light Emitting Diode), is a light-emitting semiconductor component, because of its good controllability, simple structure, small size, pure and rich colors, impact resistance, vibration resistance, fast response time, etc., it is recognized as the most advanced LED in the 21st century. One of the high-tech products with development prospects, while triggering the lighting revolution, it also makes a major contribution to promoting energy conservation, emission reduction, and environmental protection. [0003] COB is the English abbreviation of ChipOnBoarding (chip on board direct loading), which is a kind of LED chip directly pasted on the PCB (Printed Circuit Board) board through adhesive or solder, and then realizes the electrical interconnection between the chip and the PCB board through wire bondi...

Claims

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Application Information

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IPC IPC(8): H01L25/075F21V31/04F21Y115/10
CPCH01L25/0753F21V31/04F21Y2115/10
Inventor 李晓波袁凤坡孟立智唐兰香路立锋田志怀
Owner TONGHUI ELECTRONICS
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