SE diffusion method and obtained silicon wafer
A diffusion method and technology of silicon wafers, applied in the field of solar energy, can solve problems such as insufficient P concentration, poor ohmic contact of silicon wafers, high square resistance, etc., and achieve the effect of increasing P concentration, solving poor ohmic contact, and improving battery opening voltage and current
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Embodiment 1
[0057] A new SE diffusion process for increasing P concentration in PSG, including low-temperature boat feeding, stable temperature and pressure, low-temperature and low-pressure deposition, rapid heating and pressurization, high-temperature and high-pressure propulsion and oxidation, supplementary source deposition during cooling, low-temperature oxidation and low-temperature Steps to get out of the boat, the specific steps are as follows:
[0058] (1) Low-temperature boat feeding: put the textured polysilicon wafer into a diffusion furnace, set the temperature of the furnace tube at 770°C, and feed 3000ml / min of N 2 ;
[0059] (2) Stable temperature and pressure: control N 2 The flow rate is 3000ml / min, the temperature of the furnace tube is set to 790°C, and the pressure is 100mbar;
[0060] (3) Low temperature and low pressure deposition: 500ml / min O 2 , 500ml / min of N 2 -POCl 3 , set the furnace tube temperature to 790°C, the time to 16min, and the pressure to 100mba...
Embodiment 2
[0067] Except that step (6) sets the temperature of the furnace tube to 800° C., and sets the cooling time to 40 minutes so that the cooling rate is 1.5° C. / min, other methods and conditions are the same as in Example 1.
Embodiment 3
[0069] Except that in step (6) the furnace tube temperature is set to drop to 800° C., and the cooling time is set to 20 minutes so that the cooling rate is 3° C. / min, other methods and conditions are the same as in Example 1.
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